Light Curing Device Thermal Management via PCB Airflow Guidance
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Solution Overview
Problem
Hand-held light curing devices face challenges in achieving a compact design while effectively dissipating heat generated by high-power light sources, such as LEDs or laser diodes, without interfering with the patient or compromising the cooling efficiency, especially when the cooling air stream must be directed away from the light source.
Innovation Solution
A thermally conductive rod, often with a copper core, is coupled to the light source to dissipate heat rearward, where cooling ribs and a fan can efficiently manage the heat, allowing for a compact design and effective cooling without interfering with the light source or the patient, and the printed circuit board is used to guide the cooling air stream, reducing weight and space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan is used to generate a cooling air stream for the heat sink, then heat dissipation efficiency is improved, but the device becomes less compact and more complex
Solution Approach 1:
The patent combines the heat sink and printed circuit board into a single integrated structure. The PCB serves dual functions: as an electrical circuit carrier and as a heat dissipation component with integrated cooling channels. This merging eliminates the need for separate fan assemblies and complex mounting structures, reducing overall device complexity while maintaining effective cooling.
Solution Approach 2:
The printed circuit board is designed to perform multiple functions simultaneously: electrical signal transmission, power distribution, and thermal management. The PCB's copper traces and ground planes act as heat sinks, while integrated cooling channels provide fluid flow paths. This multi-functionality reduces the number of separate components needed, achieving compactness without sacrificing cooling performance.
2Volume of moving object
If the cooling air stream cross section is reduced to make the device more compact, then device size is improved, but the fan must build up increased pressure which exceeds its capability
Solution Approach 1:
The patent transitions from air-based cooling to liquid-based cooling using the printed circuit board's integrated channels. Liquid coolants (water or dielectric fluids) have higher heat capacity and thermal conductivity than air, enabling efficient heat removal through thinner, more compact channels. This hydraulic cooling approach achieves compact dimensions without requiring excessive pressure differentials.
Solution Approach 2:
The invention changes the cooling medium from gas (air) to liquid, fundamentally altering the thermal transfer parameters. Liquid coolants provide superior heat transfer coefficients, allowing the system to maintain effective cooling in a more compact configuration without requiring the fan to overcome high flow resistances. The liquid's higher density and specific heat capacity enable efficient heat removal through smaller cross-sections.
3Ease of operation
If components are arranged in the handle of the light curing device, then balance is improved, but space for heat sink and cooling components is reduced
Solution Approach 1:
The patent merges the electrical component mounting area with the heat dissipation structure by integrating the printed circuit board into the heat sink assembly. Electronic components are mounted on the PCB which is thermally coupled to the heat dissipation channels. This integration allows components to be positioned in the handle region for ergonomic balance while the thermal management function is distributed throughout the PCB structure, maximizing space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact, ergonomic design for hand-held light curing devices by efficiently dissipating heat away from the patient and effectively cooling the components, even under high power conditions, without the need for additional weight or space-consuming components.
Implementation Method 1
a thermally conductive rod, which may have a copper core, for example, is coupled to the light source with a low thermal resistance and extends to the rear from the light source
Implementation Method 2
Heat sinks which are supplied with a cooling air stream, which is generated using a fan, are therefore frequently used in order to dissipate the heat generated by the light source
Implementation Method 3
the fan must build up a correspondingly increased amount of pressure for the heat exchange in order to provide the desired cooling air stream for overcoming the flow resistances
Data Source
AI summary
The invention relates to a light curing device (10) having a light source (14), which is mounted such that it is thermally conductively connected to a heat sink (12), with electrical components which are fitted to a printed circuit board. The components are at least partially arranged in the cooling air stream of the heat sink (12) and the cooling air stream is at least partially guided by the printed circuit board.