Printed Wiring Board Component Placement Using Alignment Marks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for manufacturing printed wiring boards with built-in electronic components face challenges in accurately aligning and fixing components, leading to potential positional shifts and voids during the lamination process, which can result in mechanical and thermal stress-induced issues.
Innovation Solution
A method involving the use of alignment marks on both the electronic component and the insulative substrate, followed by resin filling and lamination, ensures precise positioning and fixation of components within an opening section of the substrate, with subsequent resin insulation layer formation and conductive circuit creation to connect electrodes, while through-holes and via conductors enhance electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment marks and resin filling are used to ensure precise component placement, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
Alignment marks are formed on both the electronic component and insulative substrate before mounting. The component is positioned on adhesive tape based on first alignment marks, then the substrate is mounted based on both first and second alignment marks to ensure the component is accommodated in the opening section. This preliminary alignment action ensures precise component placement before the actual mounting process.
Solution Approach 2:
Resin material is used as an intermediary substance to fix the electronic component to the insulative substrate. The resin fills gaps between the component and substrate, ensuring stable fixation and eliminating voids. This intermediary material resolves the complexity of achieving precise fixation without requiring extremely tight tolerances in the mounting process.
2Ease of manufacture
If adhesive tape is used for mounting components, then ease of manufacture is improved, but reliability deteriorates due to potential positional shifts during lamination
Solution Approach 1:
Alignment marks are formed on both the electronic component and insulative substrate before mounting. The component is positioned on adhesive tape based on first alignment marks, then the substrate is mounted based on both first and second alignment marks to ensure the component is accommodated in the opening section. This preliminary alignment action ensures precise component placement before the actual mounting process.
Solution Approach 2:
Resin material is used as an intermediary substance to fix the electronic component to the insulative substrate. The resin fills gaps between the component and substrate, ensuring stable fixation and eliminating voids. This intermediary material resolves the complexity of achieving precise fixation without requiring extremely tight tolerances in the mounting process.
3Device complexity
If gaps between component and substrate are left empty, then device complexity is reduced, but reliability worsens due to mechanical and thermal stress-induced issues
Solution Approach 1:
Resin material is applied locally to fill the gaps between the electronic component and the insulative substrate. This localized filling ensures that only the necessary areas are filled with resin, providing mechanical support and thermal stress relief where needed, while maintaining the overall simplicity of the structure.
Solution Approach 2:
Resin material is used as an intermediary substance to fix the electronic component to the insulative substrate. The resin fills gaps between the component and substrate, ensuring stable fixation and eliminating voids. This intermediary material resolves the complexity of achieving precise fixation without requiring extremely tight tolerances in the mounting process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures accurate component placement, reduces voids and stress, and enhances the mechanical and thermal stability of the printed wiring board by using resin to fill gaps and connect conductive circuits effectively.
Implementation Method 1
mounting the electronic component on the adhesive tape
Implementation Method 2
fixing the electronic component to the insulative substrate using resin material; The gaps between the electronic component and the inner walls of the opening section of the core substrate are filled with resin
Implementation Method 3
forming a via conductor that connects the first conductive circuit and the first electrode of the electronic component
Data Source
AI summary
A method for manufacturing printed wiring board including preparing an electronic component having first and second surfaces and electrode on the first surface, forming in an adhesive tape a mark, mounting based on the mark the component on the tape such that the second surface faces the adhesive of the tape, forming another mark on insulative substrate having first and second surfaces, forming in the substrate an opening larger than the component, mounting based on the marks the substrate on the tape such that the component is in the opening of the substrate, fixing the component to the substrate using resin, forming an insulation layer on the first surface of the substrate where the component is accommodated, removing the tape, forming in the layer an opening reaching the electrode, forming a conductive circuit on the layer, and forming in the opening of the layer a via connected to the electrode.