Antenna Structure on PCB for Communication Device
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Solution Overview
Problem
Communication devices with multiple antenna elements are complex to manufacture and prone to performance degradation due to deviations between antennas and other components.
Innovation Solution
A simplified structure for communication devices is implemented, where antenna units with patch type radiators, feeders, and conductive structures are mounted on a printed circuit board, with conductive structures designed to prevent interference between antennas and direct signals effectively, simplifying the manufacturing process and improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple antenna elements are integrated into a communication device, then the EIRP is increased and data transmission efficiency is improved, but the antenna structure becomes more complicated and difficult to manufacture
Solution Approach 1:
The antenna system is divided into multiple independent antenna elements, each with its own radiation conductor and feeding line. This segmentation allows each element to be designed and manufactured separately using standardized PCB processes, reducing overall manufacturing complexity while maintaining the ability to achieve high EIRP through coordinated operation of multiple elements
Solution Approach 2:
The patent utilizes multi-layer PCB construction to arrange radiation conductors and ground conductors on different layers. This dimensional approach allows multiple antenna elements to be integrated in a compact space without increasing planar complexity, enabling complex antenna structures to be manufactured using standard layered PCB fabrication processes
2Productivity
If multiple antenna elements are integrated into a communication device, then data transmission efficiency is improved, but manufacturing precision is degraded due to deviation between antennas and other components
Solution Approach 1:
The antenna elements are merged with the PCB structure itself, with radiation conductors and ground conductors formed as integrated traces on the board. This integration eliminates separate antenna components that would require precise mechanical alignment, as all antenna elements are manufactured in the same PCB fabrication process with inherent positional accuracy
Solution Approach 2:
The antenna structures are pre-formed as conductive patterns on the PCB during the board fabrication process, before final assembly. This preliminary formation ensures precise positional relationships between antenna elements and other PCB-mounted components are established with high accuracy through controlled manufacturing processes rather than post-assembly alignment
3Reliability
If conductive structures are added to prevent interference between antennas, then signal quality is improved, but device complexity increases
Solution Approach 1:
The conductive structures for interference prevention are extracted as separate ground conductors and shielding elements that are selectively placed between antenna elements. These structures are designed as modular components that can be added only where interference occurs, rather than uniformly across the entire device, thus improving signal quality while minimizing the increase in overall complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simplified structure enhances signal transmission and reception intensity and reduces reflection coefficients, leading to improved communication device performance and manufacturing efficiency.
Implementation Method 1
a radiation conductor formed on a circuit board constituted by multiple layers, the radiation conductor being constituted by an electrically conductive pattern formed on at least one of the multiple layers constituting the circuit board
Implementation Method 2
a ground conductor disposed on the circuit board to supply reference potential for the radiation conductor
Implementation Method 3
a feeding line disposed on the circuit board to supply power to the radiation conductor
Data Source
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AI summary
An electronic device according to an embodiment disclosed in the disclosure includes a rear cover, a cover glass that faces the rear cover, and a communication device disposed between the rear cover and the cover glass. The communication device includes a printed circuit board including a first surface, a second surface and a side surface that surrounds a space between the first surface and the second surface, a communication circuit disposed in the printed circuit board or on the first surface, and at least one antenna unit disposed in the printed circuit board or on the second surface.