Multi-Layer PCB Antenna Coupler for High Voltage Isolation
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Solution Overview
Problem
Existing antenna couplers for high-frequency applications face challenges in achieving both high dielectric strength and low transmission loss, particularly when operating with high voltage, leading to safety risks and signal attenuation.
Innovation Solution
A multi-layer printed circuit board antenna coupler design with closely spaced high-frequency lines and a shielding structure, utilizing FR-4 material for dielectric strength, and strategically arranged coplanar lines to minimize interference and maximize bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If capacitors are used for galvanic decoupling, then dielectric strength is improved, but transmission loss increases due to large design requirements
Solution Approach 1:
The patent transitions from planar capacitor-based decoupling to a three-dimensional multi-layer PCB structure with high-frequency lines arranged in different conductor levels. This vertical stacking allows galvanic isolation through the PCB core layer while maintaining close proximity for efficient signal coupling, resolving the contradiction between dielectric strength and transmission loss.
Solution Approach 2:
The multi-layer PCB structure acts as an intermediary between the antenna and the device. The PCB core layer provides galvanic isolation (dielectric strength) while the controlled impedance high-frequency lines in different conductor levels enable efficient signal transmission with minimal loss, replacing the traditional capacitor-based approach.
2Strength
If capacitor size is increased to achieve high dielectric strength, then dielectric strength is improved, but transmission loss increases due to high inductive reactance
Solution Approach 1:
The solution moves from increasing capacitor size in the planar direction to utilizing the vertical dimension with multiple conductor levels separated by the PCB core layer. This provides adequate dielectric strength through the core layer thickness while maintaining short current paths that minimize inductive reactance and transmission loss.
3Loss of energy
If high-frequency lines are placed close together, then transmission loss is reduced, but dielectric strength decreases
Solution Approach 1:
The patent places high-frequency lines in different conductor levels (vertical separation) rather than adjacent in the same plane. This allows the lines to be closely coupled for efficient transmission while the PCB core layer thickness provides adequate dielectric strength and galvanic isolation.
4Reliability
If galvanic isolation is implemented using traditional methods, then safety is improved, but signal transmission efficiency deteriorates due to high insertion loss
Solution Approach 1:
The multi-layer PCB structure serves as an intermediary that simultaneously provides galvanic isolation for safety and efficient signal transmission. The controlled impedance high-frequency lines in different conductor levels minimize insertion loss while the PCB core layer ensures galvanic isolation, eliminating the need for separate decoupling components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a high dielectric strength of up to 12 kV with minimal transmission loss, enabling efficient high-frequency signal forwarding over a wide bandwidth while ensuring safety and reducing unwanted radiation.
Implementation Method 1
the multi-layer printed circuit board having an electrically insulating printed circuit board core layer
Implementation Method 2
the antenna coupler has an electrically conductive shielding structure, which is partly on the opposite extends to the other of the two sides of the circuit board core layer and is configured to shield the first high-frequency line from interference in the conduction of high-frequency signals
Implementation Method 3
at least one first high-frequency line to be coupled or coupled to the high-frequency antenna in a first conductor level, at least one second high-frequency line to be coupled or coupled on the device side in a second conductor level
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention relates an antenna coupler (1) for connecting a high-frequency antenna to a device to which a high voltage can be applied galvanically during operation, wherein a multi-layer circuit board (2) that has conductor planes that are electrically insulated from each other in the depth direction (z) of the multi-layer circuit board (2) is provided. A first high-frequency line (3a, 3b) coupled or to be coupled with the high-frequency antenna is arranged in a first conductor plane, while a second high-frequency line (4a, 4b) coupled or to be coupled on the device side is arranged in a second conductor plane of the multi-layer circuit board (2). The multi-layer circuit board (2) has an electrically insulating circuit board core layer (6), wherein the first and second conductor planes extend on the same of the two faces of the circuit board core layer (6), and wherein the second high-frequency line (4a, 4b) coupled or to be coupled on the device side is arranged at a larger distance from the circuit board core layer (6) than the first high-frequency line (3a, 3b), and furthermore the second high-frequency line (4a, 4b) is arranged on an outer surface of the multi-layer circuit board (2). The antenna coupler (1) comprises an electrically conductive shielding structure (5), which extends partially on the opposite other of the two faces of the circuit board core layer (6) and is designed to shield the first high-frequency line (3a, 3b) and metal parts on the device side that are not part of the antenna coupler (1) from an interaction while high-frequency signals are conducted.