PCB Antenna Package Layout for Wider Display Signal Coverage
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Solution Overview
Problem
Current antenna designs in image display devices face challenges with increased driving frequency, leading to reduced reception coverage and transmission loss due to structural and environmental factors, and the shrinking space for antenna mounting in thinner devices.
Innovation Solution
An antenna package is developed with a printed circuit board configuration that includes a rear antenna unit integrated with the board and a front antenna unit on the bottom side, both electrically connected, featuring a conductive layer, ground layers, and dielectric layers to enhance radiation coverage and reliability, with independent control via a single driving IC chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the driving frequency of the antenna is increased to implement high frequency or ultra-high frequency band communications, then the communication capability is improved, but the reception coverage is relatively decreased and transmission loss increases
Solution Approach 1:
The antenna system is divided into multiple antenna units (first antenna unit, second antenna unit, third antenna unit) positioned at different locations and orientations. Each unit operates at high frequency but collectively they provide omnidirectional coverage, resolving the contradiction between high frequency operation and reception coverage by distributing multiple segmented antenna elements throughout the device structure.
2Length of moving object
If the image display device becomes thinner to improve portability, then the device thickness is reduced, but the space for antenna mounting decreases
Solution Approach 1:
The antenna units are positioned in three-dimensional space at different heights and locations (first antenna unit at first height, second antenna unit at second height, third antenna unit at third height). This vertical and spatial distribution allows sufficient antenna mounting space to be achieved within a thin device profile by utilizing the Z-dimension rather than requiring large planar area.
3Reliability
If transmission loss is reduced to improve signal quality, then antenna sensitivity increases, but structural complexity increases due to additional ground layers and dielectric layers
Solution Approach 1:
The antenna units are electrically connected to each other and to a single driving integrated circuit chip, forming an integrated antenna system. The ground layers and dielectric layers are merged into a unified printed circuit board structure that provides both mechanical support and electromagnetic functionality. This integration reduces the number of separate components and connections needed, thereby reducing overall structural complexity while maintaining low transmission loss through optimized electrical connections.
Data Source
AI summary
An antenna package according to an embodiment of the present invention includes a printed circuit board, a rear antenna unit disposed at an upper portion of the printed circuit board. The rear antenna unit may be directly mounted on the printed circuit board or integrated with the printed circuit board, and a front antenna unit disposed at a bottom side of the printed circuit board and electrically connected to the printed circuit board. The rear antenna unit and the front antenna unit are packaged using the printed circuit board to improve a radiation coverage and reliability.