PCB Fill-Cut Antenna Layout for MIMO Isolation in Bezel Devices
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Solution Overview
Problem
Securing space for antenna components and maintaining antenna performance is challenging in electronic devices due to limited space and interference issues, particularly with multiple-input and multiple-output (MIMO) communication technologies and 5G sub-6 communication technologies.
Innovation Solution
The electronic device incorporates a design with a printed circuit board that includes a first and second fill-cut area, utilizing interposers to separate antenna feeding units and grounds, and a metal frame with conductive portions to enhance antenna performance and isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If antenna components are disposed on the printed circuit board, then the number of antennas and antenna bandwidth are increased, but the fill-cut area cannot be secured and antenna performance deteriorates
Solution Approach 1:
The printed circuit board is divided into multiple layers, with antenna components disposed on specific layers and fill-cut areas created on other layers. This segmentation allows simultaneous presence of antenna components and fill-cut areas, maintaining antenna performance while supporting multiple antennas.
Solution Approach 2:
The patent transitions from two-dimensional planar arrangement to three-dimensional multi-layer arrangement. By utilizing vertical stacking of circuit board layers, the design secures fill-cut areas in the vertical dimension while maintaining antenna components on different layers, resolving the space conflict.
2Quantity of substance
If multiple antennas are arranged in limited space, then MIMO and sub-6 band support are improved, but space for fill-cut area and antenna components cannot be secured
Solution Approach 1:
The patent utilizes the vertical dimension by implementing multi-layer circuit board structure. Fill-cut areas and antenna components are arranged on different layers, effectively using three-dimensional space to accommodate both requirements within the same device footprint.
Solution Approach 2:
The design nests antenna components and fill-cut areas within the multi-layer structure of the printed circuit board. Each layer contains specific components or cut areas, with layers nested vertically to maximize space utilization while maintaining electrical isolation and antenna performance.
3Device complexity
If antenna components are disposed on the printed circuit board, then component integration is improved, but isolation between antennas deteriorates
Solution Approach 1:
The printed circuit board is segmented into multiple layers with antenna components on separate layers. This spatial segmentation provides natural isolation between antennas, reducing electromagnetic interference while maintaining integrated component design within the multi-layer structure.
Solution Approach 2:
The multi-layer circuit board structure acts as an intermediary between antenna components. The intermediate layers provide electromagnetic shielding and isolation, preventing harmful interference between antennas while allowing all components to be integrated within the same board assembly.
Data Source
AI summary
An electronic device of various embodiments of the present disclosure may include: a display, a side bezel including at least one conductive portion, and a printed circuit board disposed inside the side bezel. The printed circuit board may include an interposer, and a first printed circuit board and a second printed circuit board electrically connected through the interposer. The first printed circuit board may include a first fill-cut area, and the second printed circuit board may include a second fill-cut area corresponding to the first fill-cut area, and a ground or feeding unit comprising a conductive feed of an antenna using the conductive portion may be disposed in the first fill-cut area or the second fill-cut area.