PCB Antenna Module EMI Shielding via Segmented Vias
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Solution Overview
Problem
Printed circuit boards face challenges with electromagnetic interference (EMI) shielding, signal loss due to static electricity, and via cracks when bent, particularly in high-frequency applications like 5G mmWave communications.
Innovation Solution
A printed circuit board design featuring an insulating body with a wiring pattern surrounded by a conductor pattern and conductive vias, where one end of the via is connected to the insulating body, providing EMI shielding and preventing via cracks during bending by disconnecting the conductive via from the conductor pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductor pattern and conductive vias are connected to form a continuous EMI shielding structure, then EMI shielding effectiveness is improved, but via cracks occur when the substrate is bent
Solution Approach 1:
The conductive via structure is segmented into two separate components: a first conductive via connected to the first conductor pattern for EMI shielding, and a second conductive via disconnected from the conductor pattern that extends through the entire insulating body. This segmentation prevents continuous stress transmission that causes via cracks during bending while maintaining EMI shielding functionality through the first via.
Solution Approach 2:
The insulating body serves as an intermediary that physically separates the first and second conductive vias, allowing the first via to provide EMI shielding connectivity while the second via provides structural reinforcement without being electrically connected to the conductor pattern. This intermediary structure prevents stress transfer that would cause via cracks.
2Adaptability or versatility
If the printed circuit board is made flexible to enable bending, then adaptability is improved, but via cracks occur during bending
Solution Approach 1:
The conductive via system is divided into a first via connected to the conductor pattern and a second via that is disconnected and extends through the insulating body. This segmentation allows the flexible substrate to bend without transmitting stress to the conductor pattern connection, preventing via cracks while maintaining flexibility.
3Object-affected harmful factors
If a continuous conductive via structure is used for EMI shielding, then EMI shielding is improved, but signal loss increases due to static electricity generation
Solution Approach 1:
The conductive via structure is segmented so that the first conductive via provides EMI shielding by connecting to the conductor pattern, while the second conductive via is disconnected from the conductor pattern. This discontinuity prevents static electricity generation and signal loss while maintaining EMI shielding effectiveness through the first via.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively shields EMI, reduces signal loss, and prevents via cracks, enhancing the stability and efficiency of high-frequency signal transmission in flexible printed circuit boards.
Implementation Method 1
radio frequency (RF) signals in a high frequency band (for example, 28 GHz, 36 GHz, 39 GHz, 60 GHz, etc.) may be damaged by electromagnetic interference (EMI) due to electromagnetic noise between adjacent circuits during transmission of the RF signals
Data Source
AI summary
The present disclosure relates to a printed circuit board and a module including the same. The printed circuit board includes an insulating body, a wiring pattern embedded in the insulating body, and a first conductor pattern disposed on the insulating body and overlapping at least a portion of the wiring pattern in a first direction. First conductive vias each penetrate a portion of the insulating body and are respectively disposed on opposite sides of the wiring pattern, in a second direction orthogonal to the first direction, to surround at least a portion of the wiring pattern. Each first conductive via has a first surface connected to the first conductor pattern, and a second surface, opposite to the first surface, connected to the insulating body.