Multi-Layer PCB Antenna Spatial Arrangement for Bandwidth and Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing antenna structures face challenges in increasing bandwidth for multiple frequency bands and isolating signals of different frequencies, leading to undesired transmission and reception characteristics and weakened isolation characteristics due to parasitic electric fields and cross-pole coupling.
Innovation Solution
The proposed solution involves a Printed Circuit Board (PCB) with multiple patch antenna elements of different sizes, where the central points of smaller antenna elements are spaced closer to the central axis than those of larger elements, and the antenna elements are arranged to optimize spacing based on wavelength, preventing parasitic electric fields and improving isolation between frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple patch antenna elements are used to increase bandwidth for multiple frequency bands, then the bandwidth and multi-frequency capability are improved, but parasitic electric fields and cross-pole coupling occur leading to weakened isolation characteristics
Solution Approach 1:
The patent applies local quality by configuring different patch antenna elements with specific spacing arrangements relative to the central axis. Low-frequency patches are positioned farther from the central axis while high-frequency patches are positioned closer, creating localized spatial differentiation that reduces parasitic electric field interference between different frequency bands while maintaining multi-band operation capability
Solution Approach 2:
The patent resolves the contradiction by transitioning from a single-plane antenna arrangement to a multi-layer three-dimensional structure. Patch antenna elements are distributed across multiple layers with controlled spacing from the central axis, utilizing the vertical dimension to achieve frequency-dependent spatial separation that reduces parasitic coupling while maintaining compact form factor
2Volume of moving object
If antenna elements are closely spaced to reduce device size, then the compactness is improved, but isolation characteristics between different frequency bands deteriorate
Solution Approach 1:
The patent employs multi-layer three-dimensional arrangement where antenna elements are distributed vertically across multiple PCB layers. This spatial distribution in the vertical dimension enables adequate isolation between frequency bands while maintaining a compact horizontal footprint, effectively resolving the contradiction between compactness and isolation characteristics
Solution Approach 2:
The patent implements frequency-specific spatial positioning where low-frequency patches are positioned farther from the central axis and high-frequency patches are positioned closer, with each frequency band's elements arranged in dedicated regions. This localized quality differentiation maintains reliable isolation characteristics while achieving compact overall device dimensions
3Reliability
If patch antenna elements are arranged with larger spacing to reduce parasitic electric fields, then isolation characteristics are improved, but the device area increases
Solution Approach 1:
The patent utilizes the vertical dimension by distributing patch antenna elements across multiple PCB layers rather than spreading them out in a single plane. This three-dimensional arrangement achieves the necessary isolation characteristics through vertical separation and frequency-dependent radial positioning while maintaining a compact horizontal device area
Solution Approach 2:
The patent implements a nested arrangement where high-frequency patch elements (smaller size) are positioned closer to the central axis and can be spatially nested within the broader distribution pattern of low-frequency elements. This nested configuration achieves adequate isolation between frequency bands while minimizing the overall device area
Data Source
AI summary
Presented herein is an electronic device comprising a Printed Circuit Board (PCB) including a first circuit board plane including a plurality of first patch antenna elements and a second circuit board plane including a plurality of second patch antenna elements, a communication module that transmits and receives a signal of a first frequency band using the plurality of first patch antenna elements, and transmits and receives a signal of a second frequency band higher than the first frequency band using the plurality of second patch antenna elements, a processor connected to the communication module, wherein central points of the plurality of first patch antenna elements are spaced apart from one another to have a first distance and central points of the plurality of second patch antenna elements are spaced apart from one another to have a second distance shorter than the first distance, and wherein the plurality of second patch antenna elements are arranged such that the central points of the plurality of second patch antenna elements are disposed to be closer to a central axis connecting a first central point that is a center of gravity of the first circuit board plane and a second central point that is a center of gravity of the second circuit board plane in a direction passing through the printed circuit board from a first surface to a second surface of the printed circuit board, than central points of the plurality of first patch antenna elements.