PCB Antenna Through-Hole Layout for Lower Signal Loss
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Solution Overview
Problem
Printed circuit boards (PCBs) with antenna structures face signal loss due to blind hole connections and increased board thickness in up-down configurations.
Innovation Solution
A manufacturing method involving a stacked board structure with through holes and antenna conductors connected across layers, reducing signal loss and board thickness by transitioning from an up-down to a left-right structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If antenna structures use an up-down structure with blind holes, then the antenna conductors can be connected across layers, but the signal loss increases and board thickness increases
Solution Approach 1:
The patent transitions from a vertical up-down connection structure using blind holes to a horizontal left-right connection structure using through holes. This dimensional change allows antenna conductors to connect across layers through the side walls of adjacent substrates, reducing signal path length and improving signal integrity while decreasing board thickness.
Solution Approach 2:
Instead of connecting antenna conductors vertically through blind holes from one surface to embedded layers, the patent inverts the connection approach by using through holes that pass horizontally through the side walls of stacked substrates, enabling direct left-right connections between adjacent layers.
2Ease of manufacture
If antenna structures use an up-down structure with blind holes, then the antenna conductors can be connected across layers, but the board thickness increases
Solution Approach 1:
The patent changes the connection dimension from vertical (up-down) to horizontal (left-right) by using through holes through side walls. This allows antenna conductors to connect across stacked layers without increasing the vertical board thickness, as the connections now extend horizontally between adjacent substrates.
3Loss of energy
If through holes are used to connect antenna conductors across layers, then signal loss is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the stacked board into separate substrate layers with through holes formed in the side walls of each substrate. This segmentation allows each layer to be manufactured and processed independently, with through holes created at specific locations to enable horizontal connections between adjacent layers, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method reduces signal loss during transmission and decreases PCB thickness by directly connecting antenna conductors across layers, improving signal integrity and board design efficiency.
Implementation Method 1
electroplating a layer of copper in the slots and on sidewalls of the through holes
Data Source
AI summary
The present application provides a circuit board and a manufacturing method thereof. The manufacturing method includes: providing a stacked board; the stacked board includes a third conducting circuit, a second substrate, a first conducting circuit, a first substrate, and a second conducting circuit, which are stacked disposed in that order; defining several through holes on a surface of the stacked board along a stacked direction of the stacked board; and manufacturing antenna conductors in the through holes. The antenna conductors are disposed in the through holes on a surface of the stacked board, the antenna conductors on different layers are connected to corresponding conducting circuits, some of the antenna conductors are directly connected with the conducting circuit. A loss of signals while transmitting is reduced, and the circuit board including the antenna structure is changed from an up-down structure into a left-right structure for reducing a board thickness.