Multi-Layer PCB Antenna Isolation via Vertical Overlap
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Solution Overview
Problem
Conventional single-layer and double-layer printed circuit boards are insufficient for complex electronic devices with multiple antennas, as they require additional space for isolators to prevent interference, leading to increased board size and crowded circuit configurations.
Innovation Solution
A multi-layer printed circuit board design where antennas on different layers overlap isolators in a perpendicular direction, reducing the number of isolators needed and minimizing board area by allowing antennas to share isolator space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple antennas are equipped to enhance reception ability and bandwidth, then communication performance is improved, but the area occupied by antennas and isolators increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional multi-layer configuration. Antennas are distributed across multiple PCB layers (first layer, second layer, third layer) with isolators positioned between layers, utilizing the vertical dimension (thickness direction) to achieve spatial separation. This allows multiple antennas to coexist without requiring proportional increases in board footprint area.
Solution Approach 2:
The patent implements a nested structure where isolators are positioned between antenna layers, with the first isolator located between the first and second layers, and the second isolator between the second and third layers. The antenna elements and isolators are interconnected through vias and conductive structures, creating a compact integrated assembly where components are embedded within the multi-layer structure rather than occupying separate planar spaces.
2Reliability
If isolators are added to prevent mutual interference between antennas, then signal quality is improved, but the number of components and device complexity increases
Solution Approach 1:
The isolators serve multiple functions simultaneously: they provide electromagnetic isolation between antennas on adjacent layers, act as structural support elements in the multi-layer configuration, and can be integrated with grounding structures and via arrangements. The first isolator and second isolator are positioned to isolate multiple antenna pairs across different layer interfaces, reducing the total number of isolator components needed compared to a planar configuration.
Solution Approach 2:
The patent merges the isolation function with the structural layering of the PCB. The isolators are integrated into the multi-layer stack-up design, where they form part of the structural framework rather than being separate add-on components. The conductive vias and grounding structures are combined with the isolator positions to create a unified isolation and grounding system.
Data Source
Figure 1A~1B
Figure 2A~2B
AI summary
The present invention discloses a printed circuit board (PCB). The printed circuit board includes a plurality layers, a first antenna, a second antenna, a third antenna and an isolator. The first antenna is arranged on a first layer of the layers. The second antenna is arranged on the first layer. The isolator is arranged on the first layer and located between the first antenna and the second antenna. The third antenna is arranged on a second layer of the layers, wherein the second layer is different from the first layer. A position of the third antenna overlaps a position of the isolator in a direction perpendicular to a surface of the printed circuit board.