Laminated PCB Antenna Module for Radiation Tuning and Warpage Control
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Solution Overview
Problem
The existing manufacturing method for PCBs with integrated antennas limits design flexibility for antenna radiation characteristics due to the difficulty in varying the gap between conductive layers used for antennas and ground planes, leading to potential damage from environmental factors like temperature and pressure.
Innovation Solution
The solution involves a design where a first PCB with a communication circuit is separately manufactured and laminated with a second PCB having antenna elements, connected via a conductive bonding member, allowing for reduced conductive layers and enhanced design freedom in antenna radiation characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the same number of conductive layers are disposed on both sides with reference to a center base to prevent damage during manufacturing, then manufacturing reliability is improved, but design freedom for antenna radiation characteristics deteriorates
Solution Approach 1:
The antenna module is divided into a first PCB and a second PCB that are laminated together. The first PCB contains the antenna and the second PCB contains the ground plane, allowing independent optimization of each component while maintaining manufacturing reliability through symmetric lamination structure.
2Stability of the object's composition
If multiple conductive layers are laminated with the same gap to prevent warpage or tearing during manufacturing, then manufacturing stability is improved, but antenna performance optimization deteriorates
Solution Approach 1:
The design transitions from optimizing gap distances within a single PCB to optimizing the lamination structure of multiple PCBs. The first and second PCBs are laminated together with connection terminals extending in opposite directions, allowing antenna performance optimization through inter-PCB configuration rather than intra-PCB layer spacing.
3Manufacturing precision
If conductive layers are closely spaced to improve antenna radiation characteristics, then antenna performance is improved, but susceptibility to manufacturing damage increases
Solution Approach 1:
The antenna and ground plane are segmented into separate PCBs (first PCB and second PCB) that are laminated together. This segmentation allows the antenna to achieve optimal radiation characteristics through its dedicated conductive layers while the overall structure maintains manufacturing robustness through the symmetric lamination configuration with equal thickness on both sides.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of conductive layers, enhances design flexibility for antenna performance, and mitigates manufacturing-related damages by allowing independent adjustment of antenna and ground plane configurations.
Implementation Method 1
a conductive bonding member which is disposed between the first surface and the fourth surface, and is configured to electrically connect the at least one first antenna and the first wireless communication circuit
Implementation Method 2
a second PCB which includes at least one antenna; a first wireless communication circuit which is electrically connected with at least one connection terminal formed on the first PCB, and is configured to transmit and/or receive a signal of a first frequency band through the at least one first antenna
Data Source
AI summary
According to an embodiment of the present invention, an electronic device may comprise: a first printed circuit board which includes a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; a second printed circuit board which includes a third surface facing the first direction and a fourth surface facing the second direction and includes at least one first antenna; a first wireless communication circuit which is electrically connected to at least one connection terminal formed on the first printed circuit board and transmits and receives a signal of a first frequency band through the at least one first antenna; and a conductive bonding member which is disposed between the first surface and the fourth surface and electrically connects the at least one first antenna and the first wireless communication circuit. Various other embodiments may be included.