AR Superimposition for PCB Invisible Layer Visibility
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Solution Overview
Problem
In the context of printed wiring boards with multiple layers, existing technologies fail to provide clear visibility of components and wiring patterns across all layers, especially when defects occur, as information on invisible layers is not directly accessible without physically turning the board or for multilayer boards, where inner layer connections are difficult to confirm.
Innovation Solution
An information processing system that captures images of printed wiring boards using a camera and superimposes designated component or wiring information onto the visible layer in an augmented reality (AR) manner, allowing users to see information related to components or wiring patterns on invisible layers as if they were transparent, using a terminal device with a processor, memory, and display controller to store and process arrangement information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If information related to components or wiring on invisible wiring layers is not displayed on the currently visible wiring layer, then the display remains simple and clear, but the user cannot know the position of components or wiring that are not directly visible
Solution Approach 1:
The patent applies dimensionality change by projecting three-dimensional spatial information from invisible wiring layers onto the two-dimensional visible layer display. The processor determines the spatial relationship between the visible and invisible layers, then maps the position of designated components or wiring from the invisible layer onto corresponding positions on the visible layer, enabling users to perceive hidden information in the current viewing dimension without physically manipulating the board.
Solution Approach 2:
The patent introduces an intermediary processing system that acts as a mediator between the physical board and the user's perception. The processor serves as an intermediary that calculates spatial relationships, determines visibility status, and generates appropriate display information. This intermediary layer translates invisible physical structures into visible digital representations, allowing users to access information from invisible layers without direct observation.
2Loss of information
If the board is physically turned or manipulated to view invisible layers, then information on all layers becomes accessible, but the process becomes time-consuming and inconvenient
Solution Approach 1:
The patent creates a digital copy or representation of the invisible layer information and displays it overlaid on the visible layer. Instead of requiring physical manipulation to view different layers, the system captures images of the board, generates digital models of the wiring layers, and renders the invisible layer information as a visual copy that can be superimposed on the visible layer display, providing immediate access to hidden information without time loss.
Solution Approach 2:
The patent replaces the mechanical action of physically turning or manipulating the board with a computational system. The processor automatically determines spatial relationships, calculates visibility status, and generates display information through algorithms rather than mechanical operations. This substitution eliminates the need for manual board manipulation while providing the same information access functionality.
3Loss of information
If multiple wiring layers are displayed simultaneously without superimposition, then each layer is clearly visible, but the spatial relationship between layers becomes difficult to understand
Solution Approach 1:
The patent merges the display of multiple wiring layers by superimposing the invisible layer information onto the visible layer display. Instead of showing separate images for each layer, the system combines them into a single integrated view where invisible components or wiring are displayed at their corresponding spatial positions on the visible layer, maintaining clear visibility of wiring patterns while preserving spatial relationships between layers.
Solution Approach 2:
The patent employs color changes to differentiate between visible and invisible layer information in the superimposed display. By assigning different colors or visual characteristics to information from different layers, the system enables users to distinguish between layers while maintaining their spatial relationships in a single integrated view, enhancing both visibility and spatial recognition simultaneously.
Data Source
AI summary
An information processing apparatus includes: a processor configured to: if a part of a designated wiring or a designated component is arranged in an invisible wiring layer of a printed wiring board other than a currently visible wiring layer of the printed wiring board when superimposing and displaying, on a captured image of the printed wiring board, information related to the component or wiring which has been designated from among plural components and plural wirings arranged on the printed wiring board, display information related to the part of the designated wiring or the designated component on the currently visible wiring layer.