PCB Assembly with Photonic Integrated Circuit for Optical Alignment
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Solution Overview
Problem
The increasing demand for high bandwidth transmission in fiber optic networks has made optical interconnects more complex and expensive due to tighter component tolerances, leading to challenges in accurately positioning and aligning optoelectronic components, particularly in flip-chip technologies and enhanced data rate applications, resulting in high yield loss and increased costs.
Innovation Solution
A printed circuit board assembly with a photonic integrated circuit (PIC) that includes a silica layer for optical signal transmission, supporting optoelectronic transducers like VCSELs and photodiodes, and an optical coupler for precise alignment and conversion between electrical and optical signals, using a silicon interposer and 3D glass fanout for improved accuracy and assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional PCB assembly methods are used for optical interconnects, then manufacturing simplicity is maintained, but manufacturing precision and alignment accuracy deteriorate
Solution Approach 1:
The patent merges the optical alignment function with the PCB structure by integrating a precision alignment fixture directly into the PCB assembly. This fixture includes alignment marks and mechanical guides that are built into the PCB layers, combining the structural support function with the precision positioning function, thereby improving alignment accuracy without proportionally increasing overall assembly complexity
Solution Approach 2:
The patent introduces an intermediary alignment fixture that mediates between the PCB and optical components. This fixture serves as a precision reference structure that enables accurate positioning of optical elements relative to the PCB, acting as a bridge between the mechanical PCB structure and the optical alignment requirements
2Reliability
If tighter component tolerances are implemented for high bandwidth transmission, then transmission quality improves, but manufacturing precision requirements increase and costs rise
Solution Approach 1:
The patent implements preliminary alignment actions by pre-defining precise mechanical reference structures and alignment fixtures on the PCB before component assembly. These pre-built reference features establish accurate positioning baselines that guide subsequent component placement, ensuring that components are positioned within required tolerances without requiring excessively tight manufacturing tolerances on all components
Solution Approach 2:
The patent replaces reliance on purely mechanical tight tolerances with a hybrid system that uses mechanical reference structures combined with optical alignment verification. This substitution allows for relaxed mechanical tolerances while maintaining final alignment accuracy through optical measurement and adjustment procedures
3Speed
If complex optical interconnect structures are used for enhanced data rate, then bandwidth transmission improves, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent segments the optical interconnect assembly into modular functional units, each with its own simplified alignment and mounting structure. By dividing the complex interconnect into separate modules (transmitters, receivers, coupling elements), each module can be assembled and tested independently with simpler alignment requirements, reducing the overall complexity of the complete assembly process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables higher accuracy in positioning and alignment of optoelectronic components, reducing signal loss and improving assembly efficiency, thus addressing the complexity and cost issues in high bandwidth applications by using a photonic integrated circuit with a silica layer and optical coupler for precise signal conversion and alignment.
Implementation Method 1
a photonic integrated circuit comprising a layer of silica configured for transmitting optical signals
Implementation Method 2
an optoelectronic transducer connected to the photonic integrated circuit and configured to convert between the optical signals and the corresponding electrical signals
Data Source
AI summary
An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.