Printed Circuit Board Asymmetric Thermal Resistance Conductor
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Solution Overview
Problem
In electronic components that generate heat, such as driver ICs, thermal interference occurs when multiple components with different heat values are mounted on a printed circuit board, leading to increased temperatures and size issues due to the need for larger heat radiation areas to prevent overheating, especially when heat sinks are not used.
Innovation Solution
A printed circuit board design that includes a first electronic component with a heat radiation pad, a first circuit component, a second electronic component with a higher heat value, and a second circuit component, where the components are connected through a conductor with a lower thermal resistance between the second heat radiation pad and the first terminal, allowing effective heat dissipation without a heat sink and reducing the board's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the area of the conductor pattern is increased to dissipate heat from electronic components, then heat radiation effectiveness is improved, but the size of the printed circuit board increases
Solution Approach 1:
The patent applies local quality by creating asymmetric thermal resistance distribution in the conductor pattern. Specifically, the conductor pattern is designed with different thermal resistance values in different regions: the thermal resistance between the second heat radiation pad (higher heat value) and the first terminal is made lower than the thermal resistance between the first heat radiation pad and the first terminal. This localized differentiation allows preferential heat dissipation from high-heat components without requiring uniform expansion of the entire conductor pattern, thus reducing overall board size while maintaining effective heat radiation.
2Adaptability or versatility
If multiple electronic components with different heat values are mounted on the printed wiring board, then functional versatility is improved, but thermal interference occurs leading to temperature increase
Solution Approach 1:
The patent resolves thermal interference in multi-component systems by implementing local quality through differentiated thermal resistance paths. Each electronic component's heat dissipation characteristics are addressed individually: components generating higher heat (second electronic component) are provided with lower thermal resistance paths to the first terminal, while components generating less heat (first electronic component) have higher thermal resistance paths. This localized thermal management allows multiple components with different heat values to coexist without mutual thermal interference, maintaining both functional versatility and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat from electronic components without adding a heat sink, reducing the size of the printed circuit board while maintaining efficient thermal management, thereby addressing thermal interference and size constraints.
Implementation Method 1
heat from an electronic component can be effectively dissipated without adding a heat sink
Data Source
AI summary
A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.