Light-Emitting Board Asymmetry and Segmentation for Thermal Management
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Solution Overview
Problem
Existing flat panel displays with nonmetallic printed circuit boards (PCBs) face inefficiencies in heat emission and labor-intensive installation processes, affecting the performance and productivity of light sources.
Innovation Solution
A display apparatus featuring light-emitting board units with main PCBs arranged to enhance heat emission efficiency and simplified installation, utilizing a conductive pattern layer for power supply and a heat diffusion sheet for efficient heat dissipation, and a sub board unit for electrical connection, along with hooks for secure attachment to the chassis without screws or pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If light sources are installed on a nonmetallic PCB, then the installation is simple, but heat emission efficiency deteriorates
Solution Approach 1:
The patent divides the PCB into two distinct parts: a nonmetallic PCB for electrical connections and a separate metallic heat dissipation plate for thermal management. This segmentation allows each component to perform its specialized function optimally - the nonmetallic PCB maintains installation simplicity while the metallic plate provides superior heat emission efficiency.
Solution Approach 2:
The patent combines the nonmetallic PCB and metallic heat dissipation plate into an integrated light-emitting board unit. The two materials are firmly coupled together to form a unified structure that simultaneously achieves simple installation (through the nonmetallic PCB) and efficient heat emission (through the metallic plate).
2Reliability
If PCB is fixed using screws or pins, then connection is secure, but installation time increases
Solution Approach 1:
The patent replaces the traditional mechanical fastening system (screws or pins) with a simplified insertion-based mounting mechanism. The light-emitting board unit is designed to be directly inserted into the chassis, eliminating the need for complex mechanical fasteners while maintaining secure connection and significantly reducing installation time.
3Device complexity
If light source packages are arranged symmetrically on PCB, then design is simple, but heat emission efficiency deteriorates
Solution Approach 1:
The patent employs asymmetric arrangement of light source packages on the PCB, positioning them closer to one longitudinal edge rather than distributing them symmetrically. This asymmetric configuration optimizes heat emission efficiency by facilitating better thermal contact with the metallic heat dissipation plate, while the overall design remains relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat emission efficiency and simplifies the installation process of light-emitting board units, enhancing productivity and reducing the time required for setup compared to traditional methods.
Implementation Method 1
a heat diffusion sheet which is formed on a lower surface of the board main body
Data Source
AI summary
A display apparatus is provided. The display apparatus includes a display panel which displays an image; a top chassis and a bottom chassis which house the display panel; and a plurality of light-emitting boards which are installed on an inner surface of the bottom chassis, each of the light-emitting boards including a main printed circuit board (PCB) that extends in a longitudinal direction and light source packages installed on the main PCB, and the light source packages are arranged to be farther from a first longitudinal edge of the main PCB than a second longitudinal edge of the main PCB.