PCB Back Drilling with Measured Bore Position and Depth Adjustment
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Solution Overview
Problem
Existing machining technologies for circuit boards face challenges in achieving precise back drilling due to variations in layer positioning and thickness, as well as inaccuracies in pilot hole placement, leading to incomplete removal of copper layers and mechanical issues.
Innovation Solution
A machining station equipped with a measuring device and data processor to acquire and process data on the position of bores and layers, allowing for adjustments in drilling position and depth to ensure precise alignment and removal of copper layers during back drilling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If drilling is performed to a predetermined depth without measurement, then the machining process is simple and fast, but the positioning accuracy of bores deteriorates due to layer position variations and pressing operation deviations
Solution Approach 1:
The patent applies preliminary action by performing measurement of layer positions and bore locations before the actual back drilling operation. The measuring device captures data about the actual positions of conducting layers and reference bores, and this information is used to calculate adjusted drilling parameters in advance, ensuring precision without adding complexity to the machining execution
Solution Approach 2:
The patent implements feedback by using a measuring device to detect the actual positions of layers and bores, comparing them with nominal positions, and using this feedback information to adjust the drilling depth and position. The data processor calculates the difference between actual and nominal positions and adjusts the back drilling parameters accordingly, creating a closed-loop control system that maintains precision
2Manufacturing precision
If the process window for back drilling is made very small to achieve precision, then bore positioning improves, but the tolerance for positioning errors decreases, leading to incomplete copper removal or mechanical problems
Solution Approach 1:
The patent applies dynamics by making the back drilling process adaptive rather than fixed. The drilling depth and position are dynamically adjusted based on real measurement data from the measuring device. The system calculates the actual position of each conducting layer and reference bore, then dynamically modifies the drilling parameters for each specific location, allowing the process to accommodate variations while maintaining precision and reliability
Solution Approach 2:
The patent implements parameter changes by modifying the drilling depth and position parameters based on measured actual positions. The data processor calculates adjusted parameters including drilling depth, drill offset in x and y directions, and adjusts these parameters for each bore location. This dynamic parameter adjustment expands the effective process window while maintaining precision, as each bore is drilled with parameters optimized for its specific position
Data Source
AI summary
The disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool (10, 13, 14). The machining station has a measuring device (16) for acquiring data relating to the position of bores, a drill (10, 13, 14) for generating bores in the workpiece (1), and a data processor (17) for processing data of the at least one measuring device (16) and/or for controlling the at least one drill (10, 13, 14). The data processor (17) is here suitable and set up for performing an adjustment between a desired drilling position and/or a desired bore depth and an actual position and/or actual depth as determined by the at least one measuring device (16) for a bore present in the workpiece (1), and adapting the drilling position and/or bore depth for generating bores by means of the at least one drill (10, 13, 14).