PCB Back Drilling with Measured Bore Position and Depth Correction
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Solution Overview
Problem
Modern circuit board manufacturing faces challenges in precise back drilling due to positioning inaccuracies and variations in layer thickness, leading to incomplete removal of copper stubs and mechanical issues, especially in high-frequency applications.
Innovation Solution
A machining station equipped with a measuring device and data processor that acquires and processes data to adjust drilling positions and depths based on reference bore measurements, allowing for precise adaptation of bore positions and depths to ensure accurate back drilling, using methods like X-ray analysis and CCD camera imaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If drilling is performed to a predetermined depth, then the drilling process is simple, but the drilling accuracy deteriorates due to layer position variations and board thickness variations
Solution Approach 1:
The system performs preliminary actions by first drilling pilot holes to a predetermined depth, then measuring the actual bore positions and depths, and finally using this measurement data to calculate and apply corrections for the back drilling process. This preliminary measurement and calculation phase enables subsequent precise machining despite initial variations in layer positions and board thickness.
Solution Approach 2:
The system implements feedback by using measuring devices to detect the actual positions and depths of through bores, then feeding this information back to the data processor which calculates corrected drilling parameters. This closed-loop feedback mechanism allows the system to compensate for positioning inaccuracies and achieve precise back drilling results.
2Manufacturing precision
If the pilot hole diameter is slightly different from the back drilling diameter, then the process window is very small, but positioning inaccuracies and drill flexibility cause deviations from the desired location
Solution Approach 1:
The system measures the actual positions of pilot holes after drilling, then uses this feedback information to calculate corrected drilling positions for the back drilling process. This compensates for positioning inaccuracies and drill flexibility issues, ensuring that the final back drilling occurs at the correct location despite the small process window.
Solution Approach 2:
The system dynamically adjusts drilling parameters (position and depth) based on measured data from the pilot holes. By changing the drilling parameters according to actual measurements rather than using fixed predetermined values, the system maintains reliability despite the small process window created by the slight diameter difference between pilot and back drilling.
3Productivity
If back drilling is performed without measurement data, then the process is fast, but the accuracy of copper stub removal deteriorates
Solution Approach 1:
The system performs preliminary measurement of through bore positions and depths before back drilling, then uses this data to calculate optimal back drilling parameters. This preliminary action ensures that the subsequent back drilling process is both accurate in removing copper stubs and efficient in execution.
Solution Approach 2:
The system uses measurement data from the through bores as feedback to determine the precise drilling depth and position for back drilling. This feedback mechanism ensures accurate copper stub removal while maintaining productivity by avoiding unnecessary trial-and-error drilling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the accuracy of back drilling by minimizing errors and ensuring complete removal of copper stubs, thereby improving electrical and mechanical performance of circuit boards.
Implementation Method 1
using methods like X-ray analysis and CCD camera imaging
Implementation Method 2
using methods like X-ray analysis and CCD camera imaging
Data Source
AI summary
The disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool (10, 13, 14). The machining station has a measuring device (16) for acquiring data relating to the position of bores, a drill (10, 13, 14) for generating bores in the workpiece (1), and a data processor (17) for processing data of the at least one measuring device (16) and/or for controlling the at least one drill (10, 13, 14). The data processor (17) is here suitable and set up for performing an adjustment between a desired drilling position and/or a desired bore depth and an actual position and/or actual depth as determined by the at least one measuring device (16) for a bore present in the workpiece (1), and adapting the drilling position and/or bore depth for generating bores by means of the at least one drill (10, 13, 14).