PCB Backer for LCD Heat Spreading and Interconnection
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Solution Overview
Problem
Conventional display assemblies with metal back plates suffer from uneven heat distribution, leading to hot spots that can damage components and reduce device performance due to poor thermal conductivity.
Innovation Solution
A printed circuit board (PCB) backer made of glass reinforced epoxy laminate with copper fingers is used to distribute heat evenly, providing structural support and electrical routing, while copper's high thermal conductivity helps dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If steel alloy back plates are used for structural support, then mechanical strength is improved, but heat distribution deteriorates
Solution Approach 1:
The patent employs a composite material system consisting of a steel alloy back plate combined with aluminum heat spreader layers. The steel plate provides the required structural strength and support, while the aluminum layers bonded to its surface serve as thermal management components. This composite structure resolves the contradiction by allowing each material to perform its optimal function - steel for mechanical support and aluminum for heat distribution.
2Temperature
If aluminum backing plates are used for heat distribution, then thermal conductivity is improved, but structural support deteriorates
Solution Approach 1:
The invention creates a composite structure where aluminum layers are bonded to the steel alloy back plate. The aluminum provides superior thermal conductivity for even heat distribution across the display assembly, while the underlying steel plate maintains the required structural strength and support. This composite approach allows the aluminum to excel at heat management without compromising mechanical integrity.
3Ease of manufacture
If conventional metal back plates are used, then manufacturing simplicity is improved, but hot spot formation worsens
Solution Approach 1:
The patent implements a composite back plate structure combining steel and aluminum layers bonded together. While slightly more complex than conventional single-material plates, the manufacturing process remains practical through established bonding techniques. The aluminum layers specifically address hot spot formation by distributing heat evenly across the display assembly, preventing the concentrated heat buildup that occurs with uniform steel plates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The PCB backer effectively spreads heat across the display assembly, preventing damage from hot spots and enhancing device performance by optimizing heat dissipation and structural integrity.
Implementation Method 1
copper's high thermal conductivity helps dissipate heat efficiently
Implementation Method 2
a second layer of copper configured to transmit electrical signals across the first surface of the glass reinforced epoxy laminate substrate
Data Source
AI summary
The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device.