Composite PCB Backplate for Thin-Profile Cooling and Shielding
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Solution Overview
Problem
Traditional backplates for printed circuit boards (PCBs) face challenges in meeting the mechanical dimensions required by PCIe standards while maintaining effective heat dissipation, shielding, and protection from external impacts and electromagnetic interference, especially in computing and memory-intensive electronic devices.
Innovation Solution
A backplate comprising a sandwich structure with a high thermal conductivity middle sheet (e.g., graphite) sandwiched between stainless steel inner and outer sheets, featuring thermal pads and structural elements like ribs and separators to manage heat dissipation and mechanical stiffness within the 2.67 mm height constraint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional backplates are made thinner to meet PCIe height constraints, then mechanical dimension compliance is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The backplate uses a composite structure with multiple layers including copper sheets, aluminum sheets, and graphite sheets bonded together. Each material contributes its superior thermal conductivity properties, creating a composite backplate that achieves high heat dissipation performance in a thin profile that meets PCIe height constraints
Solution Approach 2:
The backplate is divided into multiple functional layers (copper layers, aluminum layers, graphite layers) that are bonded together. This segmentation allows each layer to optimize for specific thermal conduction paths while collectively achieving superior overall heat dissipation in a compact thickness
2Productivity
If more memory capacities are added to graphic cards, then computing and memory performance is improved, but heat generation increases
Solution Approach 1:
The backplate acts as an intermediary thermal management component between the heat-generating memory and computing components on the graphic card and the external environment. It provides a dedicated thermal conduction pathway that efficiently transfers heat away from the components, enabling high-performance computing and memory operations without excessive heat accumulation
3Length of moving object
If backplate thickness is reduced, then PCIe compatibility is improved, but mechanical protection capability deteriorates
Solution Approach 1:
The backplate employs composite materials including copper sheets, aluminum sheets, and graphite sheets bonded together. This composite construction provides enhanced mechanical strength and rigidity compared to single-material backplates of the same thickness, maintaining protective capability while meeting thin profile requirements for PCIe compatibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat dissipation, mechanical protection, and electromagnetic shielding within the specified dimensions, ensuring compatibility with PCIe standards and enhancing the performance of PCBs in computing and memory-intensive devices.
Implementation Method 1
The second sheet has a higher conductivity than those of the first sheet and the third sheet and is configured to spread heat faster than the other two sheets and eventually dissipate heat via the third sheet
Implementation Method 2
The thermal pad can quickly transmit heat from an electronic component of the PCB to the second sheet, bypassing the first sheet
Data Source
AI summary
Disclosed herein are a backplate for a PCB and a method for protecting and cooling a PCB and its backside components. The backplate, which can be attached to a backside of a PCB, includes a second sheet sandwiched between a first sheet and a third sheet. The backplate may include a thermal pad penetrating the first sheet and contacting the second sheet. The second sheet has a higher thermal conductivity than the conductivities of the first and third sheets.