PCB Barrier Layer and Segmented Metal for High-Density Reliability
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Solution Overview
Problem
There is a growing need for lighter, smaller, and high-density printed circuit boards that can efficiently connect electronic components such as semiconductor chips and main boards, while maintaining improved reliability and minimizing defects like misalignment and undercut issues.
Innovation Solution
The proposed printed circuit board includes a first insulating layer, a first metal layer with protruding, buried, and protrusion components, and a barrier layer with an inorganic oxide film. This configuration allows for improved connection reliability and reduced defects by integrating the metal layer components and protecting the insulating layer during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a high-density circuit structure is implemented to connect logic semiconductors and memory semiconductors, then the connection density and performance are improved, but the reliability of connection with electronic components deteriorates due to increased complexity and potential misalignment
Solution Approach 1:
The metal layer is segmented into distinct functional parts: a protruding part that extends beyond the insulating layer for external connections, a buried part embedded within the insulating layer for internal routing, and a protrusion that bridges between them. This segmentation allows each part to be optimized for its specific function while maintaining overall connection reliability in high-density configurations
Solution Approach 2:
The metal layer transitions from a two-dimensional planar structure to a three-dimensional structure by protruding beyond the insulating layer surface and embedding portions within it. This dimensional change enables higher connection density by utilizing vertical space while maintaining reliable electrical connections through the integrated multi-part metal structure
2Ease of operation
If the metal layer protrudes beyond the insulating layer to enable external connections, then the ease of connection is improved, but the manufacturing precision deteriorates due to alignment difficulties and potential undercut defects
Solution Approach 1:
The barrier layer is formed on the insulating layer before the metal layer is deposited. This preliminary action provides a controlled interface that guides metal layer formation, prevents unwanted metal diffusion into the insulating layer, and establishes defined boundaries that improve alignment precision during subsequent manufacturing steps
Solution Approach 2:
The barrier layer acts as an intermediary between the insulating layer and the metal layer. It mediates the interaction by providing a controlled transition zone that prevents direct contact between metal and insulating layer materials, thereby preventing undercut defects and improving manufacturing precision while still allowing the metal layer to protrude for connections
3Reliability
If the metal layer is embedded within the insulating layer to improve connection reliability, then the reliability is improved, but the device complexity increases due to additional manufacturing steps
Solution Approach 1:
The protruding part, buried part, and protrusion of the metal layer are formed as an integrated structure through a single metal deposition step. This merging of multiple functional elements into one manufacturing operation reduces process complexity while achieving reliable connections through the embedded buried part that is seamlessly integrated with the protruding portions
4Reliability
If a barrier layer with inorganic oxide film is added to protect the insulating layer, then the reliability is improved by preventing defects, but the device complexity increases due to additional layers
Solution Approach 1:
The barrier layer with inorganic oxide film serves multiple functions simultaneously: it protects the insulating layer from metal diffusion and contamination, provides a controlled interface for metal layer formation, prevents undercut defects at the metal-insulating layer interface, and maintains electrical isolation. This multi-functionality justifies the additional layer by delivering multiple reliability benefits in a single structural element
Data Source
AI summary
A printed circuit board includes a first insulating layer; a first metal layer having a part protruding beyond the first insulating layer and another part buried in the first insulating layer; and a barrier layer disposed on the first insulating layer. The barrier layer includes an inorganic oxide film.