PCB Barrier Blocks Impurities in Semiconductor Molding
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Solution Overview
Problem
In the manufacturing of semiconductor packages, existing technologies face challenges in preventing the introduction of impurities during the molding process, which can lead to cracking or breaking of the sealing material and defects in the semiconductor packages, particularly in package-on-package (POP) structures.
Innovation Solution
A printed circuit board (PCB) design featuring a substrate with a barrier formed on the gate dummy area, extending in a line and protruding from the upper surface, which blocks impurities during the molding process, thereby minimizing defects and enhancing the reliability of semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If molding resin is injected during the molding process, then semiconductor packages are manufactured, but impurities are introduced into the active area causing defects
Solution Approach 1:
A barrier structure is formed on the dummy area before the molding process begins. This barrier prevents impurities from being introduced into the active area during subsequent molding operations, thereby maintaining product quality while enabling continuous high-volume manufacturing
Solution Approach 2:
The barrier acts as an intermediary element between the molding resin injection path and the active area. It intercepts impurities carried by the molding resin and prevents them from reaching the semiconductor units mounted on the active area, thus protecting the final product
2Productivity
If multiple PCBs are connected to form PCB strips for increased throughput, then processing yield improves, but complexity of the manufacturing system increases
Solution Approach 1:
The PCB is divided into distinct functional areas: an active area for mounting semiconductor units and a dummy area containing the barrier structure. This segmentation allows the barrier to be implemented on individual PCBs or PCB strips without complicating the overall manufacturing system architecture
Solution Approach 2:
The barrier structure is localized to the dummy area of the PCB, specifically positioned to intercept impurities without interfering with the active mounting areas. This localized approach maintains simplicity in the active regions while providing protection where needed
Data Source
AI summary
Provided are a printed circuit board (PCB) capable of blocking introduction of impurities during a molding process so as to reduce damage on a semiconductor package, a method of manufacturing the PCB, and a method of manufacturing a semiconductor package by using the PCB. An embodiment includes an apparatus comprising: a substrate body comprising an active area and a dummy area on an outer portion of the active area, the substrate body extending lengthwise in a first direction; a plurality of semiconductor units mounted on the active area; and a barrier formed on the dummy area, wherein the barrier extends in the first direction.