Thermal Diffusion Member Structure for Thin PCB-Battery Layouts
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Solution Overview
Problem
The miniaturization of electronic devices has led to insufficient thermal diffusion performance due to the limited thickness of thermal diffusion members, necessitating improved thermal management structures.
Innovation Solution
The electronic device incorporates a thermal diffusion member with a first diffusion portion extending along the length direction and a second diffusion portion extending along the width direction, integrated into the housing with support portions to enhance heat dissipation, and includes a flexible printed circuit board for electrical connectivity and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the thermal diffusion member is reduced to achieve miniaturization, then the device size is reduced, but the thermal diffusion performance deteriorates
Solution Approach 1:
The patent transitions from a single-layer planar thermal diffusion member to a three-dimensional multi-layer stacked structure. Multiple thermal diffusion members are stacked in the thickness direction with heat sources positioned between layers, creating vertical heat diffusion paths that compensate for the reduced individual layer thickness while maintaining compact overall device dimensions.
Solution Approach 2:
The thermal diffusion system is segmented into multiple independent thermal diffusion members stacked in layers. Each layer can be optimized independently for thickness and material properties, while collectively providing enhanced thermal diffusion performance through the stacked configuration with heat sources positioned between layers.
2Temperature
If multiple thermal diffusion members are stacked to improve thermal diffusion performance, then the thermal diffusion performance is improved, but the device thickness increases
Solution Approach 1:
Heat sources are nested between the stacked thermal diffusion members, utilizing the inter-layer spaces for functional component placement. This nesting approach allows the heat sources to be integrated within the thermal diffusion structure itself, eliminating the need for additional separate spaces and reducing overall device thickness despite the multi-layer configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively improves thermal diffusion performance by distributing heat generated by the printed circuit board to other areas of the device, maintaining efficient operation despite the compact design.
Implementation Method 1
An electronic device may diffuse heat generated by a printed circuit board to an area where a battery is positioned using a thermal diffusion member
Data Source
AI summary
An electronic device includes: a housing; a display disposed on one surface of the housing; a printed circuit board disposed in an interior of the housing; a battery disposed in one direction of the printed circuit board in the interior of the housing, the battery includes a first portion and a second portion located at an end facing the printed circuit board; and a thermal diffusion member between the printed circuit board and the display and between the battery and the display. The thermal diffusion member includes a first diffusion portion which at least a portion of overlaps with the printed circuit board and at least a portion extends in the first portion of the battery, and a second diffusion portion between the second portion of the battery and the first diffusion portion and extended to be overlapped with at least a portion of the second portion of the battery.