Printed Circuit Board Bending Adhesive Exclusion
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Solution Overview
Problem
Conventional printed circuit boards face issues with wiring damage and layer separation when their structure is thinned to reduce bezel width, necessitating a solution to protect wirings and maintain structural integrity during bending.
Innovation Solution
A circuit board design featuring an adhesive layer between substrates, excluding the bending portion, along with wrinkles on the insulating substrate and a thinner supporting substrate, to prevent separation and facilitate effective bending without damaging light emitting elements or wirings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the printed circuit board structure is thinned to reduce bezel width, then the bezel width is reduced, but the wirings are damaged and layers are separated
Solution Approach 1:
The adhesive layer is segmented by creating a non-adhesive bending portion that separates the rigid adhesive regions from the flexible bending region, allowing the board to thin while maintaining wiring integrity during bending operations
2Length of stationary object
If the printed circuit board structure is thinned to reduce bezel width, then the bezel width is reduced, but the layers are separated from each other
Solution Approach 1:
The adhesive layer is divided into bonded regions and a non-adhesive bending portion, creating distinct functional zones that maintain layer stability in rigid areas while allowing controlled separation in the bending area to prevent delamination
Solution Approach 2:
The adhesive layer has different properties in different regions: it is bonded in most areas to maintain layer stability, but has a non-adhesive bending portion that allows local flexibility and prevents delamination during bending
3Reliability
If the insulating substrate is formed with wrinkles in the bending portion, then the wirings and light emitting elements are protected from damage, but the manufacturing complexity increases
Solution Approach 1:
Wrinkles are pre-formed in the insulating substrate at the bending portion location before final assembly, preparing the substrate to accommodate bending stresses and protect wirings during subsequent bending operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents separation of the insulating substrate from the supporting substrate during bending, allowing for reduced bezel width while protecting wirings and ensuring the integrity of the printed circuit board structure.
Implementation Method 1
an adhesive layer between the supporting substrate and the insulating substrate except for the bending portion
Data Source
AI summary
Provided is a printed circuit board, comprising: a supporting substrate including a first region and a second region extending to be bent from the first region; an insulating substrate above the supporting substrate; a bending portion bent between the first region and the second region; and an adhesive layer between the supporting substrate and the insulating substrate and except for the bending portion.