Protective Layer on PCB Bending Portions
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Solution Overview
Problem
The challenge is to maintain the structural integrity and reduce damage to wirings on thinner printed circuit boards used in liquid crystal display backlight units, as they are prone to damage during bending, which complicates the production and design of slim bezel designs.
Innovation Solution
A protective layer is strategically formed around the wiring portions on the bending portions of the printed circuit board, made from materials like polyimide, polyester, or epoxy resin, to prevent damage during bending, allowing for a slim structure without compromising the integrity of the circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the printed circuit board structure is made thinner to reduce bezel width, then the bezel width is reduced and the display becomes thinner, but the wirings connected to light emitting elements are damaged
Solution Approach 1:
The bending portion of the printed circuit board is divided into multiple layers: a first bending portion containing wirings, a second bending portion containing light emitting elements, and a protective layer. This segmentation allows each layer to be optimized independently - the wirings are protected in the first bending portion while light emitting elements are mounted in the second bending portion, resolving the contradiction between thinning the board and protecting wirings.
Solution Approach 2:
The wirings are formed on the first bending portion before the light emitting elements are mounted on the second bending portion. This preliminary formation of wirings in a protected location prevents damage during subsequent mounting processes and ensures wiring integrity before the board is thinned to reduce bezel width.
2Volume of moving object
If the printed circuit board is made thinner, then the backlight unit becomes thinner, but the structural integrity during bending is compromised
Solution Approach 1:
The bending portion is segmented into a first bending portion for wirings and a second bending portion for light emitting elements, with each portion having optimized thickness and structural properties. This allows the overall board to be thinner while maintaining sufficient bending strength in each segmented region.
Solution Approach 2:
Different regions of the bending portion have different structural qualities - the first bending portion has wiring protection structures, the second bending portion has light emitting element mounting structures. This local differentiation allows each region to have the specific strength needed for its function while keeping the overall board thin.
Data Source
AI summary
Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.