Circuit Board Heat Dissipation Block Clamping to Prevent Warping
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Solution Overview
Problem
Circuit boards warp due to thermal expansion mismatch between copper heat dissipation blocks and components, and existing methods for fixing these blocks are prone to displacement during peeling.
Innovation Solution
A circuit board design featuring open substrates with protruding fixing portions that clamp a heat dissipation block, such as ceramic or composite materials, directly between these portions, eliminating the need for adhesive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper heat dissipation block is used, then heat conduction is improved, but thermal expansion mismatch causes circuit board warping
Solution Approach 1:
The patent changes the material parameter (CTE) of the heat dissipation block from copper (high CTE) to ceramic or composite materials (low CTE matching the PCB), thereby resolving the thermal expansion mismatch while maintaining heat conduction functionality
Solution Approach 2:
The patent employs composite materials (ceramic or composite) for the heat dissipation block that combine low thermal expansion properties with adequate heat conduction capability, balancing the conflicting requirements of thermal management and dimensional stability
2Manufacturing precision
If adhesive layer method is used to fix heat dissipation block, then positioning is improved, but displacement occurs during peeling process
Solution Approach 1:
The patent removes the adhesive layer from the fixing process entirely, using instead a mechanical clamping structure formed by recesses and protrusions that directly secures the heat dissipation block without any bonding agent, thereby eliminating the peeling displacement problem
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical interlocking mechanism (recesses and protrusions), providing more reliable fixation that does not involve peeling or bonding failures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes the heat dissipation block, preventing warping and displacement, while maintaining effective heat conduction and component performance.
Implementation Method 1
a heat dissipation block is usually disposed to conduct the heat generated by the electronic components to outside of the wiring structure
Implementation Method 2
The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion
Data Source
AI summary
A method of manufacturing a circuit board is provided. The method includes forming an open substrate, in which the open substrate includes a substrate body having a top surface and a bottom surface; an opening in the substrate body, in which the opening has a first sidewall and a second sidewall opposite to the first sidewall; and at least one first fixing portion and at least one second fixing portion extending from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. A heat dissipation block is inserted in the opening to clamp the heat dissipation block between the first fixing portion and the second fixing portion, in which the heat dissipation block includes the heat dissipation block comprises a ceramic or a composite material.