PCB Board Edge Connector with Inner Tie Bar for SATA Signal Integrity
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Solution Overview
Problem
Existing SATA board edge connectors face signal degradation issues due to tie bars extending beyond the edge of the PCB, which prevents electroplating while maintaining the required distance from the SATA I/O standard, leading to suboptimal voltage signal integrity.
Innovation Solution
A method involving a tie bar on the inner layer of a PCB, a trace on the outer layer, and a via to electrically couple the tie bar to the trace, allowing for electroplating of the contact while maintaining the necessary distance, thereby forming a board edge connector with gold-plated contacts that match the signal integrity of solder-down SATA connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If tie bars are used to electroplate contacts on a board edge connector, then the contacts can be gold-plated to improve signal integrity, but the tie bars extend beyond the edge of the PCB causing the contacts to not be at the required distance from the SATA I/O standard
Solution Approach 1:
The patent moves the tie bar from the edge of the PCB to the inner layer, changing its spatial dimension. This allows the tie bar to remain electrically connected to the contact through a via while not extending beyond the PCB edge, thus maintaining both signal integrity and compliance with SATA I/O distance requirements
Solution Approach 2:
The tie bar is nested within the inner layer of the PCB structure, with the contact on the outer layer and a via connecting them. This nested arrangement allows the electroplating function to be achieved while keeping the tie bar contained within the PCB, preventing it from extending beyond the edge
2Ease of manufacture
If the connector is formed on the PCB using tie bars and vias, then fabrication cost is reduced compared to solder-down connectors, but signal degradation occurs when tie bars extend beyond the PCB edge
Solution Approach 1:
By relocating the tie bar to the inner layer, the patent maintains the cost-effective PCB formation method while eliminating the signal degradation issue that occurs when tie bars extend beyond the PCB edge. The via connection preserves electrical continuity without the harmful exposure
3Ease of manufacture
If tie bars extend beyond the edge of the PCB to electroplate contacts, then contacts can be formed, but the contacts do not reach the edge of the PCB and are not at the particular distance required by SATA I/O standard
Solution Approach 1:
The patent resolves the distance issue by moving the tie bar to the inner layer and using a via to connect to the contact on the outer layer. This dimensional change allows the contact to be positioned at the correct distance from the SATA edge while the tie bar remains inside the PCB for proper electroplating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable voltage signal integrity comparable to solder-down SATA connectors while reducing fabrication costs by forming the connector on the PCB, without causing signal degradation.
Implementation Method 1
sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact
Data Source
AI summary
Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.