PCB Bonding Groove Structure for Multilayer Alignment and Yield
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Solution Overview
Problem
The accumulation of defects per layer in multilayer substrates used in printed circuit boards, particularly those requiring microcircuits, leads to a decrease in yield, especially when coupling multiple wiring portions.
Innovation Solution
A printed circuit board design featuring a first wiring portion with a groove on its surface and a bonding portion that fills this groove, along with a protruding portion of the second conductor layer, enhances structural stability and electrical connectivity by improving alignment and adhesion between laminated wiring portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of laminations of substrate is increased to achieve more wiring portions, then the functionality and complexity of the printed circuit board is improved, but the defect rate per layer accumulates and overall yield decreases
Solution Approach 1:
The printed circuit board is divided into multiple separate wiring portions (first wiring portion, second wiring portion, etc.) that are manufactured independently and then coupled together through bonding portions. This segmentation allows each portion to be optimized and manufactured separately, reducing the cumulative defect rate while maintaining the overall functionality of a multilayer structure.
Solution Approach 2:
The bonding portion is disposed within a groove formed in the first wiring portion, creating a nested structure where the bonding portion is embedded in the groove. This nesting approach enhances the coupling between wiring portions and improves structural stability, thereby increasing overall yield.
2Adaptability or versatility
If multiple wiring portions are coupled together to form a multilayer substrate, then the electrical connectivity and functionality are improved, but the alignment precision and adhesion between layers become more difficult to maintain
Solution Approach 1:
A groove is pre-formed in the first wiring portion before the bonding portion is disposed. This preliminary action creates a precise alignment feature that guides the bonding portion into the correct position, ensuring accurate alignment between stacked wiring portions and maintaining manufacturing precision.
Solution Approach 2:
The bonding portion is specifically disposed within a groove located at a specific position in the first wiring portion, creating a localized high-adhesion region. This local quality approach ensures precise alignment and strong adhesion at the critical coupling interface between wiring portions.
3Stability of the object's composition
If a bonding portion is disposed between wiring portions to connect them, then the structural stability is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The bonding portion integrates multiple functions: it provides structural adhesion between wiring portions, enables electrical connectivity through conductor layers, and ensures alignment through the groove structure. By merging these functions into a single component, the overall manufacturing process complexity is reduced despite the added structural stability.
Data Source
AI summary
A printed circuit board includes a first wiring portion including a first insulating layer and a first conductor layer, a second wiring portion including a second insulating layer and a second conductor layer, and disposed on the first wiring portion, and a bonding portion disposed between the first and second wiring portions, connecting the first and second wiring portions to each other, and including a bonding layer and a metal filler dispersed in the bonding layer, wherein the first wiring portion includes a groove formed on a surface facing the bonding portion, and the bonding portion fills the groove.