PCB Boss Hole Current Line Layout for Higher Allowable Current
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Solution Overview
Problem
Conventional PCBs face challenges in securing allowable current as energy density increases in constrained physical and spatial environments, particularly in battery management units (BMUs) of smaller and lighter IT products like smartphones and laptop computers, due to limited space for horizontal current lines.
Innovation Solution
A PCB with a boss hole featuring a vertically disposed electrical pattern along its inner side surface, allowing for additional electrical patterns and multiple layers, connected via connection portions to conventional circuit patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the BMU becomes denser and smaller to accommodate higher energy density battery modules, then the energy density of the battery pack is increased, but the space for current lines is reduced and the allowable current becomes smaller
Solution Approach 1:
The patent transitions current line arrangement from a two-dimensional horizontal plane to a three-dimensional vertical structure by forming current lines along the inner side surface of the boss hole. This dimensional change allows current lines to utilize the vertical space within the boss hole, effectively increasing the allowable current capacity without occupying additional horizontal space on the PCB surface.
2Productivity
If the width of current lines is decreased to fit more components, then the component density is increased, but the maximum allowable current is reduced
Solution Approach 1:
The patent resolves this contradiction by moving current lines from horizontal PCB surface to vertical boss hole inner surface, enabling current lines to be arranged in three dimensions rather than constrained to two dimensions. This allows narrow current line widths on the PCB surface while maintaining high current capacity through the vertical arrangement.
Solution Approach 2:
The patent nests current lines within the boss hole structure, utilizing the internal space of the boss hole for current conduction. This nesting approach allows current lines to be embedded within existing structural elements, maximizing space utilization and maintaining both component density and current capacity.
3Device complexity
If conventional horizontal current line arrangement is used, then the PCB design is simple, but there is not enough space for current lines in the remaining area after boss hole placement
Solution Approach 1:
The patent addresses the space limitation by transitioning from horizontal to vertical current line arrangement within the boss hole. This dimensional transition transforms the boss hole from a purely mechanical fixing feature into a functional element that also provides current conduction pathways, effectively increasing available space without adding PCB area.
Solution Approach 2:
The patent makes the boss hole multi-functional by combining its mechanical fixing function with electrical current conduction function. The boss hole serves dual purposes: securing the BMU to the battery pack and providing pathways for high-capacity current lines, thereby eliminating the need for separate current line routing space.
Data Source
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Figure 3a~3c
AI summary
Disclosed is a PCB including a boss hole formed in a hole shape configured to fix the PCB, wherein an electrical pattern is disposed along an inner side surface of the boss hole. Consequently, it is possible to utilize conventional PCBs without any change and to secure the allowable current as energy density increases even in increasingly constrained physical and spatial environments.