PCB Connector Header Mounted to Bottom Surface for Signal Integrity
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Solution Overview
Problem
Printed circuit boards (PCBs) face space constraints and increased complexity due to high-speed communication requirements, leading to higher attenuation, additional components, and increased costs, as existing materials do not support high-speed communication links effectively without introducing repeaters or re-timers.
Innovation Solution
A connector header is mounted to the bottom surface of the PCB, utilizing wires and cables to provide high-speed communication with lower attenuation, thereby reducing the need for additional components and simplifying design, while increasing available space and reducing power consumption and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing PCB materials are used for high-speed communication, then the PCB can be manufactured with standard materials, but the attenuation increases and additional components (repeaters or re-timers) are required
Solution Approach 1:
The patent extracts the high-speed communication function from the PCB substrate itself and relocates it to an externally mounted connector header. This separation allows the PCB to use standard materials while the connector handles the high-speed signals, eliminating the need for repeaters or re-timers on the PCB.
Solution Approach 2:
The connector header acts as an intermediary between the PCB and external high-speed communication interfaces. It mediates the signal transmission by providing a dedicated pathway for high-speed signals, isolating the PCB substrate from the demands of high-speed communication requirements.
2Reliability
If repeaters or re-timers are added to mitigate attenuation, then signal transmission quality improves, but the PCB size and power consumption increase
Solution Approach 1:
The patent removes the need for attenuation-mitigating components by extracting the high-speed communication function from the PCB substrate and placing it in an external connector header, thereby eliminating repeaters or re-timers entirely.
3Reliability
If more components are added to support high-speed communication, then communication reliability improves, but the available space on the PCB decreases
Solution Approach 1:
The patent extracts the high-speed communication components from the PCB substrate and relocates them to an external connector header, thereby preserving PCB space while maintaining communication reliability.
Solution Approach 2:
The patent moves the high-speed communication functionality from the two-dimensional PCB plane to a three-dimensional external connector that mounts on the PCB surface, effectively utilizing vertical space rather than horizontal PCB area.
4Ease of manufacture
If standard PCB materials are used, then manufacturing costs are lower, but attenuation increases requiring additional components
Solution Approach 1:
The patent extracts the high-speed signal transmission function from the PCB substrate and places it in an external connector, allowing the PCB to use cost-effective standard materials while the connector handles the high-speed signals with minimal attenuation.
Data Source
AI summary
An apparatus may include a printed circuit board, an integrated circuit mounted on a first surface of the printed circuit board, and one or more vias that extend through the printed circuit board from the first surface to a second surface of the printed circuit board to provide electrical connectivity for the integrated circuit. The second surface of the printed circuit board may be opposite the first surface of the printed circuit board. The apparatus may include a pin header that mechanically supports one or more pins that provide electrical connectivity for the integrated circuit. The pin header may be mounted to the second surface of the printed circuit board to mate the one or more pins with the one or more vias to provide electrical connectivity for the integrated circuit.