Embedded Bridge PCB Structure for Die-to-Die Thermal Stability
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Solution Overview
Problem
The use of silicon-based interposers for die-to-die electrical connections is costly and prone to reliability issues due to thermal expansion mismatch and complex manufacturing processes, and silicon interposers are difficult to form with through silicon vias.
Innovation Solution
A printed circuit board with a wiring substrate that includes insulating and wiring layers, embedding a bridge with large connection pads and a pitch, allowing for die-to-die interconnection, which can be manufactured using a PCB process, reducing manufacturing complexity and cost, and minimizing thermal expansion mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a silicon-based interposer is used for die-to-die connection, then electrical connection between dies is achieved, but manufacturing cost and process complexity increase significantly
Solution Approach 1:
The patent changes the material parameter from silicon to organic substrate material, and changes the interconnection structure parameter from TSV to embedded bridge with through-substrate vias. This parameter change resolves the contradiction by achieving electrical connection reliability through the embedded bridge structure while avoiding the complex TSV manufacturing process associated with silicon interposers.
Solution Approach 2:
The patent replaces expensive silicon interposer material with cheaper organic substrate material. The embedded bridge structure using standard PCB materials and processes provides a cost-effective alternative to silicon-based solutions, achieving the same electrical interconnection function at lower material and manufacturing cost.
2Reliability
If a silicon-based interposer is used, then die-to-die electrical connection is enabled, but material cost and manufacturing cost increase
Solution Approach 1:
The patent replaces expensive silicon interposer material with cheaper organic substrate material. The embedded bridge structure using standard PCB materials and processes provides a cost-effective alternative to silicon-based solutions, achieving the same electrical interconnection function at lower material and manufacturing cost.
Solution Approach 2:
The patent substitutes the mechanical TSV formation process in silicon with a PCB-compatible embedded bridge structure. This substitution enables manufacturing using standard PCB processes such as lamination and via formation, eliminating the need for complex semiconductor fabrication processes and significantly reducing manufacturing cost.
3Reliability
If a silicon-based interconnect bridge is used, then die-to-die connection is achieved, but reliability issues arise due to CTE mismatch
Solution Approach 1:
The patent uses organic substrate material for the bridge structure that is homogeneous with the surrounding substrate material. This homogeneity ensures matched coefficients of thermal expansion (CTE) between the bridge and substrate, eliminating the CTE mismatch problem that causes reliability issues in silicon-based interconnect bridges during thermal cycling.
4Reliability
If through silicon via (TSV) is formed in silicon interposer, then vertical electrical connection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent substitutes the mechanical TSV formation process in silicon with a PCB-compatible embedded bridge structure. This substitution enables manufacturing using standard PCB processes such as lamination and via formation, eliminating the need for complex semiconductor fabrication processes and significantly reducing manufacturing complexity.
Solution Approach 2:
The patent changes the interconnection structure parameter from TSV to embedded bridge with through-substrate vias. This parameter change resolves the contradiction by achieving vertical electrical connection reliability through the embedded bridge structure while avoiding the complex TSV manufacturing process associated with silicon interposers.
Data Source
AI summary
A printed circuit board includes: a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; and a bridge embedded in the wiring substrate and having a plurality of connection pads thereon. An uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connected to the plurality of connection pads, and a pitch between at least two adjacent connection pads of the plurality of connection pads is larger than a pitch between at least two adjacent ones of the plurality of bump pads.