PCB Bus Bar Layout for Compact Power Semiconductor Modules
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Solution Overview
Problem
Semiconductor modules face challenges in reducing size and cost while maintaining electrical and thermal characteristics, particularly in handling high currents and voltages, which affects overall costs and size.
Innovation Solution
A semiconductor module design featuring a printed circuit board with power semiconductor packages on one side and a bus bar on the same side to carry supply and ground currents, allowing for efficient heat dissipation and reduced material usage, along with a method for fabricating such modules that includes arranging bus bars over the printed circuit board to minimize space and complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If power semiconductor packages are arranged on a printed circuit board with traditional wiring, then electrical connections are established, but the module size and material consumption increase
Solution Approach 1:
The bus bar is merged with the printed circuit board structure, where the bus bar serves as both a current carrier and a structural element of the module. This integration eliminates the need for separate wiring components and reduces overall material consumption while maintaining electrical connectivity between power semiconductor packages.
Solution Approach 2:
The bus bar performs multiple functions simultaneously: it carries supply currents, provides structural support, and serves as a mounting element for power semiconductor packages. This multi-functionality reduces the number of separate components needed, thereby reducing material consumption and simplifying the module structure.
2Loss of energy
If traditional wiring methods are used for power semiconductor packages, then electrical connections are made, but ohmic losses increase
Solution Approach 1:
The bus bar is directly integrated with the printed circuit board, creating short and direct current paths between power semiconductor packages. This eliminates the need for long, complex wiring routes and reduces the number of connection points, thereby minimizing ohmic losses while simplifying the manufacturing process.
3Reliability
If more materials and components are used to handle high currents and voltages, then electrical performance is maintained, but module size and costs increase
Solution Approach 1:
The bus bar is designed to handle both high currents and provide structural support, eliminating the need for separate structural components. This multi-functional design maintains the module's ability to handle high electrical loads while reducing the overall volume by consolidating functions into a single integrated element.
Solution Approach 2:
The bus bar is made from composite or optimized materials that provide both high electrical conductivity for handling currents and sufficient mechanical strength for structural support. This material optimization allows the module to maintain reliability under high electrical stress while minimizing the volume occupied by current-carrying components.
Data Source
AI summary
A semiconductor module includes: a printed circuit board having a first side and an opposite second side; a plurality of power semiconductor packages arranged over and electrically coupled to the first side of the printed circuit board, a first side of the power semiconductor packages facing the first side of the printed circuit board and an opposite second side being configured to be coupled to a heatsink; and at least one bus bar arranged over and electrically coupled to the first side of the printed circuit board. The bus bar is configured to carry a supply current and/or a ground current of at least some of the power semiconductor packages.