PCB Cable Assembly Cold Welding for Low-Impedance Connection
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Solution Overview
Problem
Existing soldering methods for cable assemblies introduce thermal stress and impedance issues, leading to potential damage and poor electrical performance due to high-temperature soldering processes.
Innovation Solution
A cable assembly that connects the inner conductor to a metal connection portion on a printed circuit board through a cold welding process, eliminating the need for solder and enhancing mechanical and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If hot bar soldering or laser soldering is used to connect cable to PCB, then soldering efficiency and product yield are improved, but thermal stress causes PCB expansion/contraction and internal circuit cracking
Solution Approach 1:
The patent replaces the thermal field (soldering) with a mechanical field (cold welding). Instead of using high-temperature soldering processes, the invention applies pressure and cold welding current to directly bond the cable conductor to the PCB pad, eliminating thermal stress while maintaining connection strength
Solution Approach 2:
The patent changes the fundamental parameter of the joining process from high temperature to room temperature. By using cold welding with controlled pressure and current, the process transitions from thermal bonding to mechanical/electrical bonding, resolving the thermal stress issue
2Loss of time
If high-temperature soldering process is used, then soldering speed is improved, but rapid heating and cooling cause PCB expansion and contraction leading to internal circuit cracks
Solution Approach 1:
The patent replaces the thermal field (soldering) with a mechanical field (cold welding). Instead of using high-temperature soldering processes, the invention applies pressure and cold welding current to directly bond the cable conductor to the PCB pad, eliminating thermal stress while maintaining connection strength
3Strength
If solder is used for connection, then mechanical bonding is achieved, but characteristic impedance at solder point increases affecting impedance matching
Solution Approach 1:
The patent replaces the thermal field (soldering) with a mechanical field (cold welding). Instead of using high-temperature soldering processes, the invention applies pressure and cold welding current to directly bond the cable conductor to the PCB pad, eliminating thermal stress while maintaining connection strength
Solution Approach 2:
The patent achieves homogeneous material contact by directly bonding similar metals (copper to copper or copper to copper alloy) through cold welding, eliminating the heterogeneous solder joint interface. This homogeneity ensures consistent electrical properties and characteristic impedance along the connection path
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cold welding process improves electrical performance by reducing impedance and ensuring better impedance matching between the connector and cable, thereby minimizing thermal stress and enhancing the overall electrical characteristics.
Implementation Method 1
the conductor contact portion is mechanically and electrically connected to the metal connection portion by a cold welding process
Data Source
AI summary
A cable assembly includes: a cable having an inner conductor, the inner conductor having a conductor contact portion; and a printed circuit board connected to the cable; wherein the printed circuit board includes a metal connection portion, and the conductor contact portion is mechanically and electrically connected to the metal connection portion by a cold welding process.


