PCB Cable Ground Plane Layout for RF Noise Diversion

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Solution Overview

Problem

Existing high-speed networking applications face challenges in diverting RF noise currents from cable shielding to ground due to gaps and component connections in conventional printed circuit boards, which impede the dispersion of RF interference currents.

Innovation Solution

The implementation of a printed circuit board with a solid cable ground plane coextensive with the substrate and separate from component grounding layers, coupled to a shielded RF communications cable, along with additional solid signal ground planes tightly coupled to the cable ground planes, enhances the diversion and dispersion of RF interference currents to ground.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If conventional PCB grounding layers are used with gaps and component connections, then component mounting and circuit integration are achieved, but RF noise current dispersion is impeded

Engineering Contradiction:
ImproveRF noise current dispersionVSAvoidPCB grounding layer configuration
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The grounding system is segmented into two distinct types of grounding layers: cable grounding layers specifically for RF noise current diversion and component grounding layers for functional elements. This segmentation allows each layer type to perform its specialized function without interference, resolving the contradiction between RF noise dispersion and component integration.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cable grounding function is extracted from the conventional unified grounding layer and implemented as separate cable grounding layers. These dedicated layers are positioned to receive RF noise currents from cable shields and divert them to ground without passing through component connections, thereby eliminating the interference problem while maintaining component mounting capability.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If cable grounding layer is separated from component grounding layer, then RF noise current diversion is improved, but grounding path continuity may be compromised

Engineering Contradiction:
ImproveRF noise current diversion effectivenessVSAvoidgrounding path continuity
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The PCB substrate serves as an intermediary that provides electrical connection between the separated cable grounding layers and component grounding layers. This allows RF noise currents to be diverted through dedicated cable grounding layers to ground, while maintaining overall grounding path continuity through the substrate for functional elements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively disperses RF noise currents, improving electromagnetic compatibility and reducing interference in high-speed networking environments by providing uninterrupted pathways for RF noise to reach true ground, even when oriented away from an infinite ground plane.

Implementation Method 1

configured for coupling, through the connector, to shielding of the shielded RF communications cable

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

tightly wirelessly coupled to the cable ground planes

Methodology Applied
Scientific EffectElectromagnetic coupling: Electromagnetic Induction

Data Source

PatentUS11737207B2PCB RF noise grounding for shielded high-speed interface cable
Publication Date: 2023.08.22 INFINEON TECHNOLOGIES AMERICAS CORP
  • US11737207B2 patent drawing
  • US11737207B2 patent drawing
  • US11737207B2 patent drawing

AI summary

A printed circuit board (PCB) includes a substrate defining a major plane. A first side of the major plane is configured for mounting of functional circuit elements. A cable connector is mounted on a second side of the major plane of the substrate, opposite the first side, for coupling to a shielded radiofrequency (RF) communications cable. At least one component grounding layer is parallel to the major plane and configured for coupling to the functional elements. At least one cable grounding layer is parallel to the major plane and is separated from the at least one component grounding layer. Each cable grounding layer in the at least one cable grounding layer is coextensive with the substrate and is configured for coupling, through the connector, to shielding of the shielded RF communications cable, without coupling to any other component. Nodes of an RF communications system may be mounted on such PCBs.