PCB Capacitor Mounting With Recessed Cavities and Pin Channels
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Solution Overview
Problem
The increasing demand for high-capacity storage in portable consumer electronics requires more efficient use of space on printed circuit boards (PCBs) for non-volatile memory devices, particularly in reducing the area allocated to passive components like capacitors, and improving the manufacturing efficiency of mounting these components.
Innovation Solution
The solution involves innovative techniques for mounting capacitors on PCBs, including the use of E-cap pin channels for surface mount device and reflow processing, and a wire bond process for small capacitors, which allows for reduced PCB area usage and integration into standard manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional capacitor mounting methods are used on PCBs, then reliable electrical connection is achieved, but PCB area consumption increases and manufacturing efficiency decreases
Solution Approach 1:
The patent transitions from traditional planar surface-mount capacitor placement to a vertical three-dimensional mounting configuration. Capacitors are mounted upright in recessed cavities on the PCB, with their leads extending vertically through the board. This dimensional change allows capacitors to occupy vertical space rather than horizontal PCB area, enabling higher component density and more efficient use of the PCB footprint while maintaining reliable electrical connections through the vertical lead paths.
2Reliability
If specialized offline soldering processes are used for capacitor mounting, then reliable electrical connection is achieved, but manufacturing complexity and time increase
Solution Approach 1:
The patent merges the capacitor mounting process with the standard PCB assembly manufacturing line by integrating specialized capacitor placement equipment that works in-line with existing surface-mount technology processes. The recessed cavity design allows capacitors to be positioned and soldered using modified but still integrated manufacturing equipment, eliminating the need for separate offline soldering operations. This integration maintains reliable electrical connections while reducing manufacturing process complexity and cycle time.
3Reliability
If more capacitors are mounted on PCBs to ensure proper electrical function, then electrical reliability is improved, but PCB area consumption increases
Solution Approach 1:
The vertical mounting configuration allows multiple capacitors to be stacked or arranged in three-dimensional space above the PCB surface, enabling more capacitors to be installed on the same PCB footprint. The recessed cavity design provides structural support and electrical connection pathways that accommodate vertical lead arrangements, effectively doubling or tripling the capacitor density compared to traditional planar mounting while maintaining all necessary electrical functions.
Data Source
AI summary
An electrolytic capacitor can be located in a notch in a side of a PCB with its pins resting on electrical contact pads on the surface of the PCB in a pair of channels in the upper side of the PCB extending away from the sides of the cavity and attached to the contact pads by solder paste. Alternately, the contact pads are on the upper surface of the PCB and the capacitor is located in the cavity with its pins bending upward and then back to be parallel with the upper PCB to attach to the contact pads. The pins and contact pads can be on the same side of the capacitor and cavity or on opposite sides. For smaller devices, such as a ceramic capacitors, a cavity is set into the surface of the PCB and the capacitor's terminals connected to contact pads by wire bounding.