PCB Capacitor Insulating Layer for Interface Crack Relief

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Solution Overview

Problem

Existing multilayer ceramic capacitors face issues with stress and crack formation at the interface between the capacitor and the insulating layer due to high modulus and low moisture expansion coefficients, leading to reduced reliability, especially in high temperature and humidity environments.

Innovation Solution

Incorporating an insulating layer with a low Young's modulus and low moisture expansion coefficient, along with an auxiliary insulating layer to effectively release stress and fill voids, enhancing the interface stability and reducing cracks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If an insulating layer with high modulus and low moisture expansion coefficient is used between the PCB and multilayer ceramic capacitor, then the structural stability is improved, but stress and crack formation occur at the interface leading to reduced reliability

Engineering Contradiction:

Improvestructural stabilityVSAvoidinterface reliability

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The patent changes the physical parameters of the insulating layer by selecting materials with specific Young's modulus (0.1-10 GPa) and moisture expansion coefficient (50-200 ppm/%RH) ranges. This parameter optimization allows the insulating layer to match the thermal and mechanical expansion characteristics of both the PCB and capacitor, reducing interface stress while maintaining structural stability.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material selection for the insulating layer, using materials that combine appropriate mechanical properties (Young's modulus) with specific moisture expansion characteristics. This composite approach enables the insulating layer to simultaneously provide structural support and stress relief at the interface between components with different expansion coefficients.

Inventive Principle:

Principle #40Composite materials

2Stress or pressure

If the insulating layer has low Young's modulus, then stress release is improved, but the mechanical strength decreases

Engineering Contradiction:

Improvestress releaseVSAvoidmechanical strength

Core Design Contradiction:

Stress or pressureVSStrength

Solution Approach 1:

The patent optimizes the Young's modulus parameter within a specific range (0.1-10 GPa) to achieve the right balance. This parameter change allows the insulating layer to be compliant enough to release stress during thermal cycling and moisture exposure, while maintaining sufficient mechanical strength to provide structural support and prevent component failure.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20260020159A1Electronic device and manufacturing method thereof

Publication Date: 2026.01.15 SAMSUNG ELECTRONICS CO LTD

AI summary

Provided is an electronic device including a printed circuit board (PCB), a multilayer ceramic capacitor mounted on the PCB, wherein the multilayer ceramic capacitor includes a ceramic body and a plurality of internal electrodes inside the ceramic body, and an insulating layer between the PCB and the multilayer ceramic capacitor, wherein the insulating layer is in contact with the PCB and the multilayer ceramic capacitor.