Multi-Layer PCB Capacitor Layout for EMI Field Cancellation
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Solution Overview
Problem
Existing multi-layer printed circuit boards fail to effectively suppress electromagnetic interference (EMI) generated by traces due to simple series connections of capacitors.
Innovation Solution
A multi-layer circuit board structure with oppositely arranged capacity components and via holes connected to a conductor, forming specific extension parts that create E- and U-shaped structures, allowing power signals to cancel each other's magnetic fields and reduce EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If capacitors are connected in series to ground through via holes, then the circuit structure is simple, but electromagnetic interference cannot be effectively suppressed
Solution Approach 1:
The single capacitor connection is segmented into multiple capacitors (first and second capacitors) arranged in parallel, each connected to different portions of the trace. This segmentation allows each capacitor to suppress EMI at different locations, effectively reducing overall electromagnetic interference while maintaining manufacturing simplicity
Solution Approach 2:
The invention transitions from a single-dimensional series connection to a multi-dimensional arrangement by placing capacitors on different layers of the circuit board and connecting them to different portions of the trace through via holes. This spatial distribution in multiple dimensions enhances EMI suppression capability
2Object-affected harmful factors
If multiple capacitors are added to suppress EMI, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The via holes serve multiple functions: they provide electrical connection between layers, position the capacitors, and act as part of the EMI suppression structure. This multi-functionality reduces the need for additional dedicated EMI suppression components, thereby limiting complexity increase
Solution Approach 2:
The capacitor components are nested within the circuit board structure, with capacitors positioned in recesses or cavities of the board. This nesting approach integrates EMI suppression components into the existing board architecture, minimizing additional space requirements and structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively reduces electromagnetic interference by canceling magnetic fields, enhancing signal integrity and reducing noise in the circuit board.
Implementation Method 1
allowing power signals to cancel each other's magnetic fields and reduce EMI
Implementation Method 2
The first via hole is connected to the first conductor
Data Source
AI summary
A multi-layer circuit board structure and a memory storage device are disclosed. The multi-layer circuit board structure includes a first capacity component, a second capacity component, a first conductor, and a first via hole. The first via hole is connected to the first conductor. At a first layer of the multi-layer circuit board structure, a first capacity component and a second capacity component are arranged oppositely. The first capacity component is connected to a first extension part of the first conductor. The second capacity component is connected to a second extension part of the first conductor. The first via hole is connected to a third extension part of the first conductor, and the first via hole is disposed between the first capacity component and the second capacity component.