PCB-to-Carrier Material Dome Joining Without Fastening Screws
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Solution Overview
Problem
The existing component arrangements for mounting printed circuit boards on mounting supports face challenges in simplifying the production process and reliably adjusting the clamping force, often requiring separate fastening screws and complex manufacturing steps.
Innovation Solution
A component arrangement where the material dome on the mounting support is plasticized through friction stir welding or similar heat generation methods to form an undercut, eliminating the need for fastening screws and allowing adjustable clamping force via stamp contact pressure, with optional support sleeves to distribute the force and reduce stress on the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a fastening screw is used to clamp the printed circuit board, then the board can be securely fixed to the mounting support, but the clamping force must be kept low to prevent damage, requiring complex adjustment mechanisms and separate fastening components
Solution Approach 1:
The fastening function is merged into the material dome itself. The dome is formed integrally with the mounting support and serves both as a structural element and as the clamping mechanism, eliminating the need for separate fastening screws and adjustment mechanisms.
Solution Approach 2:
The material dome undergoes plasticization through friction stir welding or similar heat generation methods, changing its physical state from rigid to pliable. This allows the dome to be formed and adjusted with controlled clamping force, preventing damage to the printed circuit board while ensuring secure fixation.
2Ease of operation
If a separate fastening screw is used, then the clamping force can be adjusted, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The material dome is formed directly on the mounting support in the desired shape and position, serving its own fastening function without requiring external fastening components. This self-integrated approach simplifies the manufacturing process and eliminates additional assembly steps.
Solution Approach 2:
The material dome is pre-formed on the mounting support before the printed circuit board is installed. This preliminary formation allows for optimized clamping force distribution and eliminates the need for complex real-time adjustment mechanisms during assembly.
3Strength
If high clamping force is applied to secure the board, then the fixation is stronger, but the printed circuit board may be damaged
Solution Approach 1:
The material dome is plasticized through controlled heat generation during the forming process, allowing it to be shaped with precise control over the clamping force. This ensures sufficient fixation strength while maintaining low enough force to prevent damage to the printed circuit board.
Solution Approach 2:
The material dome acts as an intermediary element between the mounting support and the printed circuit board. It distributes the clamping force uniformly across the board surface, preventing localized stress concentrations that could cause damage while maintaining overall fixation strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production process, reduces the complexity of adjusting clamping force, and ensures a secure, low-force clamping of the printed circuit board, minimizing damage and enhancing process reliability.
Implementation Method 1
the material dome head projecting beyond the through-hole of the printed circuit board is plasticized during the joining process in the manner of friction stir welding or another/similar method for generating temperature through friction (through rotation and contact pressure)
Implementation Method 2
generating temperature through friction (through rotation and contact pressure)
Implementation Method 3
An undercut forms between the edge of the expanded material dome head and the base surface, in which the printed circuit board is held in a form-fitting manner
Data Source
Figure 1~3
Figure 4~5
Figure 6~7
AI summary
The invention relates to a component arrangement comprising a component, such as a printed circuit board (1), which is joined to a component carrier (3), in particular made of a non-ferrous metal with a low melting point, such as aluminum, wherein the component (1) rests on a base surface (5) of the component carrier (3), from which a material dome (7) projects and which is guided through a through-hole (9) of the component (1). According to the invention, a material dome head (11) projecting beyond the through-hole (9) of the component (1) can be plasticized during the joining process by friction stir welding or a similar process for generating heat by friction (through rotation and contact pressure) or by another form of heat generation, so that the material dome head (11) expands. An undercut is formed between the edge of the expanded material dome head (11) and the base surface (5), in which the component (1) is positively retained.