PCB Cavity Structure for Precise Component Embedding and Fine Vias
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for technologies that enable the efficient processing of micro-via holes in printed circuit boards for weight reduction and size minimization in mobile devices, while also ensuring excellent electrical and mechanical properties of wiring materials and simplifying the process of embedding electronic components within these boards.
Innovation Solution
A printed circuit board design featuring a first insulating material with a second insulating material having cavities of different depths, where at least one groove portion is present on the side surfaces, and a resin layer is embedded in the second insulating material, allowing for the formation of cavities with varying depths without a separate masking process, thereby reducing process variation and enabling the integration of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If blasting process is used to form cavities for component embedding, then components can be inserted into the board, but process variation increases
Solution Approach 1:
The patent applies preliminary action by pre-forming cavities of different depths in the insulating layer before component placement. This allows for precise control of cavity dimensions and positions, eliminating the process variation associated with blasting methods while maintaining the ability to embed components effectively.
Solution Approach 2:
The patent implements local quality by creating cavities with different depths at different locations on the board. This enables each cavity to be optimally sized for its specific component, improving both the precision of cavity formation and the adaptability for various component types and sizes.
2Productivity
If micro-via holes are processed efficiently, then connection paths are shortened, but manufacturing complexity increases
Solution Approach 1:
The patent merges the cavity formation process with the micro-via processing by using the same pre-formed cavity structure for both component embedding and wiring material filling. This integration reduces manufacturing complexity while maintaining efficient connection paths between layers.
Solution Approach 2:
The cavities formed in the insulating layer serve multiple functions: they accommodate electronic components, provide pathways for wiring materials, and enable inter-layer connections. This multi-functionality reduces the need for separate processing steps, thereby reducing overall manufacturing complexity while improving productivity.
3Length of stationary object
If board thickness is reduced, then device size is reduced, but structural integrity deteriorates
Solution Approach 1:
The patent uses composite materials by combining the insulating layer with reinforcing structures and wiring materials filled in the cavities. This composite construction maintains structural integrity even when the overall board thickness is reduced, as the distributed reinforcement provides strength without increasing bulk thickness.
Solution Approach 2:
The patent compensates for reduced thickness in the vertical dimension by adding structural elements and distributing reinforcement across multiple layers and cavities. This dimensional redistribution maintains structural integrity while achieving the goal of thinner board design.
Data Source
AI summary
A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.