PCB Cavity Heat Releasing Layer for Thermal Management
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Solution Overview
Problem
Current multi-layer printed circuit board technologies face challenges in achieving high-density and high-integrated mountings while effectively managing heat dissipation in miniaturized electronic devices, such as smartphones, where traditional heat management methods are inadequate for the compact designs.
Innovation Solution
A printed circuit board design featuring insulating layers, a circuit layer, and a conductive heat releasing layer formed inside a cavity, with the heat releasing layer electrically connected to the circuit layer to enhance heat dissipation, and a method for manufacturing this board involving electroplating and patterning of metal layers to create a semiconductor package with improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional heat management methods are used in compact designs, then device miniaturization is achieved, but heat dissipation effectiveness deteriorates
Solution Approach 1:
The patent transitions from traditional planar heat dissipation to three-dimensional heat management by forming a cavity within the printed circuit board and placing a heat releasing layer along the cavity wall. This vertical integration allows heat to be dissipated through multiple dimensions (laterally through the PCB and vertically through the cavity structure), effectively managing thermal loads in miniaturized devices without increasing footprint area.
Solution Approach 2:
The heat releasing layer acts as an intermediary thermal management component between the electronic components mounted on the PCB and the surrounding environment. This intermediate layer facilitates efficient heat transfer from high-density mounted components through the PCB structure, enabling effective thermal management in compact designs where direct heat sinks cannot be easily integrated.
2Productivity
If high-density and high-integrated mountings are implemented, then electronic component integration is improved, but heat management capability deteriorates
Solution Approach 1:
The patent segments the heat dissipation function from the traditional unified PCB structure by creating a dedicated cavity region with a separate heat releasing layer. This segmentation allows the high-density mounted components to be concentrated in specific areas while the heat releasing layer provides localized thermal management, enabling independent optimization of both integration density and heat dissipation capability.
Solution Approach 2:
The heat releasing layer is strategically positioned along the cavity wall in regions where high-density components are mounted, providing localized enhanced heat dissipation capability exactly where it is most needed. This local quality approach allows the PCB to maintain high integration density in component areas while providing targeted thermal management without compromising overall device compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves heat releasing performance by directly transferring heat from components to the heat releasing layer, enhancing the thermal management of compact electronic devices and supporting high-density integration.
Implementation Method 1
a first heat releasing layer formed on an exterior surface of the cavity... The first heat releasing layer is electrically connected to at least a portion of the circuit layer
Implementation Method 2
The first heat releasing layer may include a conductive metal... effectively improves heat releasing performance by directly transferring heat from components to the heat releasing layer
Data Source
AI summary
A printed circuit board includes first and second insulating layers forming a cavity, a first heat releasing layer formed on an exterior surface of the cavity, and a circuit layer formed above or below the first the insulating layer and at least between a surface of the cavity and the first insulating layer. The heat releasing layer is electrically connected to at least a portion of the circuit layer.