PCB Cavity Formation Using Insulating Layer Modulus Difference
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Solution Overview
Problem
Existing techniques for forming cavities in printed circuit boards using a blasting process require a stopper pattern layer, which increases costs and can lead to misalignment issues, making it difficult to reduce the size of the circuit board while maintaining precision.
Innovation Solution
A printed circuit board design that uses a first insulating layer with a low modulus as a barrier layer for the blasting process, eliminating the need for a stopper pattern layer, and featuring a second insulating layer with a higher modulus for cavity formation, where the edge of the cavity is formed from insulating material, allowing for reduced process steps and alignment issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a stopper pattern layer is used in the blasting process to form cavities, then the cavity formation precision is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the stopper pattern layer from the blasting process by extracting its function and replacing it with a barrier layer made of insulating material. This simplifies the overall structure by eliminating the need for separate stopper patterns while maintaining cavity formation precision through the barrier layer's protective function.
Solution Approach 2:
The barrier layer made of insulating material serves multiple functions: it acts as a stopper during the blasting process to define cavity boundaries, provides electrical insulation, and forms part of the final cavity structure. This multi-functionality eliminates the need for dedicated stopper pattern layers, reducing device complexity.
2Manufacturing precision
If a stopper pattern layer is used in the blasting process, then the cavity formation precision is improved, but the manufacturing time and productivity are reduced
Solution Approach 1:
By removing the stopper pattern layer and its associated alignment and fabrication steps, the manufacturing process is streamlined. The barrier layer approach eliminates time-consuming pattern alignment procedures while maintaining precision, thereby improving productivity.
Solution Approach 2:
The barrier layer is formed as part of the insulating layer structure before the blasting process begins. This preliminary preparation eliminates the need for time-consuming stopper pattern fabrication and alignment steps during the blasting process, improving manufacturing efficiency.
3Manufacturing precision
If a stopper pattern layer is used, then the cavity boundaries are well-defined, but misalignment issues occur and cavity size reduction becomes difficult
Solution Approach 1:
The patent eliminates the stopper pattern layer that causes alignment issues. Instead, the barrier layer made of insulating material defines cavity boundaries without requiring separate pattern alignment, thereby eliminating misalignment problems while maintaining precise cavity definition.
Solution Approach 2:
The barrier layer acts as an intermediary between the blasting process and the underlying structures, defining cavity boundaries through material properties rather than pattern alignment. This intermediary approach eliminates misalignment issues inherent in stopper pattern methods.
4Manufacturing precision
If insulating layers with different modulus are used, then the blasting process control is improved and cavity formation precision increases, but the material selection complexity increases
Solution Approach 1:
The patent applies local quality by using insulating layers with different modulus values at different locations where needed. The barrier layer uses material with specific modulus properties optimized for blasting resistance, while other insulating layers use materials optimized for their specific functions, achieving precise cavity formation without uniform material complexity.
Solution Approach 2:
The patent employs composite material structures where insulating layers with different modulus values are combined. The barrier layer uses materials specifically selected for their resistance to blasting, while other layers use different materials optimized for insulation and structural support, creating a composite structure that achieves precise cavity formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of process steps, minimizes misalignment, and enables smaller cavity sizes by effectively using the insulating layers' modulus difference to control the blasting process, enhancing the manufacturing efficiency and precision of cavity formation.
Implementation Method 1
forming a cavity penetrating the insulating layer having a relatively high modulus by a blasting process
Data Source
AI summary
A printed circuit board includes a first insulating layer having a first modulus; a second insulating layer disposed on the first insulating layer and having a second modulus; and a cavity penetrating the second insulating layer, wherein the second modulus is greater than the first modulus, and wherein an edge portion of a bottom surface of the cavity is formed of an insulating material.