PCB Cavity Waveguide for Millimeter-Wave Integration
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Solution Overview
Problem
The integration of millimeter-wave components and substrates in distributed systems results in complex and expensive setups due to the need for discrete components like backshort surfaces, waveguides, and transmission lines.
Innovation Solution
A system utilizing a Printed Circuit Board (PCB) with laminas featuring electrically conductive plating on cavities and Vertical Interconnect Access (VIA) holes forms a waveguide structure that guides millimeter-waves, reducing the complexity and cost by integrating these components into a single PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components (backshort surfaces, waveguides, transmission lines) are used for millimeter-wave systems, then the system achieves proper wave guidance and signal transmission, but the system becomes complex and expensive
Solution Approach 1:
The patent combines multiple discrete millimeter-wave components (waveguide, backshort surface, transmission line) into a single integrated PCB structure. The cavity formed by laminas with conductive plating serves as both the waveguide and backshort, eliminating the need for separate discrete components while maintaining proper wave guidance and signal transmission functionality.
Solution Approach 2:
The PCB laminate structure performs multiple functions simultaneously: it provides mechanical support, forms the waveguide cavity through laminas with conductive plating, creates the backshort surface, and enables signal transmission through integrated probes and transmission lines. This multi-functionality reduces the number of discrete components needed.
2Reliability
If discrete components (backshort surfaces, waveguides, transmission lines) are used for millimeter-wave systems, then the system achieves proper wave guidance and signal transmission, but the system becomes expensive
Solution Approach 1:
The patent combines multiple expensive discrete millimeter-wave components into a single PCB assembly, reducing the total component count and associated costs. The integrated structure uses standard PCB manufacturing techniques (lamination, conductive plating, probe printing) rather than requiring separate fabrication processes for each discrete component.
Solution Approach 2:
The patent uses PCB manufacturing techniques to create waveguide structures that replicate the functionality of traditional discrete waveguides. The conductive plating on laminas creates equivalent electromagnetic boundaries to discrete waveguide walls, providing the same wave guidance capability at lower cost through standardized PCB processes.
3Reliability
If multiple laminas with conductive plating and VIA holes are integrated, then the waveguide structure achieves enhanced conductivity and guiding capability, but the manufacturing process becomes more complex
Solution Approach 1:
The waveguide structure is divided into multiple laminas (first lamina, second lamina, third lamina) that can be manufactured and prepared separately, then assembled together. Each lamina can be independently plated and prepared, allowing for modular manufacturing that reduces overall process complexity while achieving the desired conductivity and structural integrity.
Solution Approach 2:
The patent uses VIA holes that pass through multiple laminas to create nested conductive pathways. The VIA holes in one lamina align with and connect to conductive structures in adjacent laminas, creating a nested configuration where conductive elements are embedded within the laminated structure. This nesting approach achieves enhanced conductivity while organizing complexity in a hierarchical manner.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and cost-effective integration of millimeter-wave components, enhancing the conductivity and guiding capabilities within the PCB, thereby simplifying the system architecture and reducing costs.
Implementation Method 1
An electrically conductive plating is applied on the insulating walls of a cavity formed perpendicularly through the laminas... the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity
Implementation Method 2
The VIA holes are plated or filled with electrically conductive material, which is connected to the electrically conductive surfaces
Data Source
AI summary
A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity.