Printed Circuit Board Manufacturing Using Ceramic Base and Insulating Layers
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) face challenges in material costs and manufacturing complexity due to the use of semiconductor processes, leading to increased production costs and reduced productivity, especially when attempting to create lightweight, small, and multi-functional PCBs with high reliability.
Innovation Solution
A PCB is manufactured using a base member made of ceramic or organic material with insulating layers on both surfaces to flatten the surface, allowing for accurate recognition of the align key and simplifying the build-up process, and featuring a circuit layer connected via vias, with a protection layer formed using a liquid photodefinable material for cost reduction and improved reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a semiconductor wafer is used as the base member for interposer board manufacturing, then the PCB can achieve three-dimensional structure and small size, but the material cost increases and the manufacturing process becomes complicated
Solution Approach 1:
The patent replaces expensive semiconductor wafers with cost-effective ceramic or organic base members. This substitution maintains the functional requirements for interposer boards while significantly reducing material costs and simplifying the manufacturing process by eliminating complex semiconductor fabrication steps.
Solution Approach 2:
The patent changes the material parameter of the base member from semiconductor (Si wafer) to ceramic or organic materials. This parameter change fundamentally alters the manufacturing approach, allowing the use of simpler, more cost-effective processes while still achieving the required three-dimensional structure and compact size through alternative design approaches.
2Measurement precision
If the surface of the base member is not flattened, then the manufacturing process is simpler, but the align key recognition becomes inaccurate
Solution Approach 1:
The patent applies insulating layers to the base member surfaces in advance of the alignment and build-up processes. This preliminary action flattens the surfaces and creates a uniform foundation, ensuring that subsequent align key recognition is accurate and that the build-up process proceeds without alignment errors.
Solution Approach 2:
The insulating layer serves as an intermediary between the rough base member surface and the alignment/build-up processes. It mediates the surface irregularities by providing a flattened, uniform interface that enables accurate align key recognition while still allowing the underlying base member structure to support the required three-dimensional configuration.
3Manufacturing precision
If conventional semiconductor processes are used for interposer board manufacturing, then high precision can be achieved, but productivity decreases and production cost increases
Solution Approach 1:
The patent replaces expensive semiconductor manufacturing processes with more economical ceramic or organic base member fabrication. This substitution maintains sufficient manufacturing precision for interposer applications while dramatically improving productivity by using simpler, faster manufacturing steps that do not require complex semiconductor fabrication equipment and processes.
4Reliability
If expensive materials like semiconductor wafers are used, then high reliability can be achieved, but material cost increases
Solution Approach 1:
The patent substitutes expensive semiconductor wafers with cost-effective ceramic or organic base members. This material substitution reduces the quantity of expensive substances required while maintaining the reliability needed for interposer board applications through proper material selection and design considerations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces material costs, simplifies the manufacturing process, and enhances the reliability of the PCB by using a base member made of ceramic or organic material, allowing for efficient build-up and increased productivity while maintaining high reliability and functionality.
Implementation Method 1
an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened
Implementation Method 2
the protection layer may be formed by means of a photoresist using a liquid photodefinable material, and the opening of the protection layer may be formed using photo-exposure and development
Data Source
AI summary
Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.