PCB with Embedded Ceramic Block for Thermal Management
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Solution Overview
Problem
Current printed circuit boards face challenges in efficiently dissipating heat from high-power components due to their dielectric material substrates, which are poor thermal conductors, leading to heat accumulation and potential damage from thermal stress, especially in miniaturized designs with complex circuitry, and existing solutions like metal heat sinks or ceramic boards are either inefficient or costly and unsuitable for multi-layer boards.
Innovation Solution
A printed circuit board with a built-in vertical heat dissipation ceramic block and a high thermal conductivity layer, where the ceramic block is embedded in a through hole of the dielectric material layer, allowing for effective thermal conduction and flexible circuit layouts, reducing manufacturing costs and enabling miniaturization while maintaining good thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a dielectric material layer is used as the substrate of a printed circuit board, then the board can be made with complex multi-layer circuit designs, but the thermal conductivity is poor leading to heat accumulation and thermal stress damage
Solution Approach 1:
The patent uses a composite structure combining dielectric material layer and ceramic material layer. The dielectric layer provides good electrical insulation and circuit design flexibility, while the ceramic layer provides high thermal conductivity for heat dissipation. This composite structure resolves the contradiction by allowing complex multi-layer circuit designs on the dielectric layer while the ceramic layer efficiently conducts heat away from high-power components.
2Temperature
If metal wire or heat sink is used to improve thermal dissipation, then thermal conductivity is improved, but the thermal dissipation efficiency is not high due to inadequate dimension
Solution Approach 1:
The patent changes the dimensional parameters of the heat dissipation structure by making the ceramic material layer extend across the entire printed circuit board rather than using small metal wires or heat sinks. This large-area ceramic layer provides both high thermal conductivity and high thermal dissipation efficiency, resolving the contradiction between improved thermal conductivity and actual heat dissipation performance.
3Temperature
If heat pipe is added to improve thermal dissipation, then thermal dissipation effect is improved, but the structure becomes complicated and manufacturing cost increases significantly
Solution Approach 1:
The patent merges the heat dissipation function directly into the printed circuit board substrate by using a ceramic material layer that is integral to the board structure. This eliminates the need for separate heat pipe components and their associated complex assembly, achieving high thermal dissipation effect while maintaining simple structure and reducing manufacturing cost.
4Temperature
If aluminum is used as metal core of printed circuit board, then thermal conductivity is improved, but layout deformation occurs during manufacturing process
Solution Approach 1:
The patent uses a composite structure with dielectric material layer and ceramic material layer instead of metal core. The ceramic material provides high thermal conductivity similar to metal but without the thermal expansion issues that cause layout deformation during manufacturing. This resolves the contradiction by achieving good thermal conductivity while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal conduction for high-power components, maintaining a proper operating temperature and allowing for complex, miniaturized circuit designs, while being economical and suitable for small-batch production, thus enhancing the flexibility and efficiency of thermal dissipation.
Implementation Method 1
the ceramic block has thermal conductivity greater than the dielectric material layer... The high thermal conductivity layer has thermal conductivity greater than the ceramic block... effectively manages thermal conduction for high-power components
Data Source
AI summary
A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.