Printed Circuit Board Coil Structure for Compact Embedded Inductors
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Solution Overview
Problem
Current printed circuit boards face challenges in maintaining high magnetic permeability at high frequencies and achieving compact size while integrating inductors for efficient power supply, particularly due to the need for high-capacity inductors and the limitations of coil patterns formed in air or requiring large substrate areas.
Innovation Solution
A printed circuit board design incorporating multiple magnetic members embedded within core layers and coil patterns disposed above and below the core substrate, utilizing magnetic elements and laminates to enhance magnetic permeability and inductance performance within a compact form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coil patterns are formed in air or on large substrate areas, then inductance performance can be achieved, but the device size increases and magnetic permeability decreases at high frequencies
Solution Approach 1:
The patent transitions from planar coil patterns on the substrate surface to three-dimensional coil structures formed within embedded cavities in the core substrate. This vertical integration into the substrate thickness dimension allows for compact inductor implementation while maintaining high magnetic permeability through proximity to magnetic members.
Solution Approach 2:
The patent employs composite structures combining magnetic members (ferrite or magnetic powder) with the core substrate material. This composite approach enhances magnetic permeability at high frequencies by integrating magnetic materials directly into the substrate structure where the coil patterns are formed.
2Use of energy by moving object
If high-capacity inductors are integrated for efficient power supply, then power efficiency improves, but the inductor size and substrate area increase
Solution Approach 1:
The patent embeds coil patterns within cavities of the core substrate, nesting the inductor structure inside the substrate volume rather than placing it on the surface. This nesting approach reduces the overall inductor size while maintaining high-capacity performance for efficient power supply.
Solution Approach 2:
The patent utilizes the vertical dimension of the substrate by forming cavities through the core substrate thickness and placing coil patterns within these three-dimensional spaces. This allows high-capacity inductors to be integrated without increasing the substrate footprint area.
3Length of stationary object
If the core substrate is made thinner to reduce board thickness, then the overall board thickness decreases, but it becomes difficult to embed magnetic members effectively
Solution Approach 1:
The patent divides the core substrate into multiple layers with cavities formed in specific regions. This segmentation allows magnetic members to be embedded effectively in a thinner overall structure by creating dedicated spaces within the layered architecture, maintaining ease of manufacture while reducing board thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the printed circuit board to maintain high magnetic permeability at high frequencies and improve inductance performance, allowing for a thinner board with a thicker core while reducing the size and cost of inductor components.
Implementation Method 1
maintain high magnetic permeability even at a high frequency
Implementation Method 2
improve inductance performance
Data Source
AI summary
A printed circuit board includes: a core substrate including a plurality of core layers; a plurality of magnetic members embedded in each of the plurality of core layers; a first coil pattern disposed on the core substrate; and a second coil pattern disposed below the core substrate.