PCB Coil Structure With Integrated Heat Dissipator
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Solution Overview
Problem
Conventional coil devices face an issue of increased size due to inefficient heat dissipation in the coil portion.
Innovation Solution
A coil device design featuring a core with multiple leg portions and a board with through-holes and heat dissipators positioned to efficiently dissipate heat while maintaining a compact size, utilizing a heat transfer member to facilitate heat transfer to the base portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation pattern portions are integrally disposed with the coil patterns to dissipate heat, then heat dissipation efficiency is improved, but the size of the printed circuit board increases
Solution Approach 1:
The patent transitions from planar heat dissipation patterns on the PCB surface to three-dimensional heat dissipation structures (protrusions and recesses) that extend vertically. The coil pattern is formed on a protrusion that protrudes from the PCB surface, and the heat dissipation pattern is formed on a recess that recesses from the surface, creating vertical separation between the coil and heat dissipation areas while maintaining thermal coupling through the shared substrate.
Solution Approach 2:
The patent embeds the heat dissipation pattern within a recessed area of the PCB, effectively nesting the heat dissipation structure within the overall device footprint. The coil pattern on the protrusion and the heat dissipation pattern on the recess are integrated into a single compact structure where the heat dissipation functionality is contained within the device boundaries rather than extending the overall size.
2Temperature
If the coil pattern is made wider to improve heat dissipation, then heat dissipation efficiency is improved, but the device size increases
Solution Approach 1:
Instead of increasing the planar width of the coil pattern, the patent utilizes the vertical dimension by forming the coil on a protrusion that extends from the PCB surface. This allows the coil to have adequate cross-sectional area for heat dissipation without increasing the footprint area on the PCB, as the additional volume is achieved through vertical extension rather than lateral expansion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat generated in the coil portion while minimizing the overall size of the device, ensuring uniform magnetic flux density and efficient heat transfer.
Implementation Method 1
a first heat dissipator that is positioned in the first space and is electrically connected to the first coil portion
Data Source
AI summary
A coil device includes: a core including: a first base portion; a second base portion; a first leg portion disposed between the first and second base portions; a second leg portion disposed on a first side relative to the first leg portion; and a third leg portion disposed on a second side relative to the first leg portion; and a board including: a first through-hole, a second through hole, and a third through hole through which the first to third leg portions are respectively inserted; and a wiring portion. The second leg portion includes two leg pieces spaced apart to define a first space that is open toward the first leg portion. The wiring portion includes: a first coil portion surrounding the first through-hole; and a first heat dissipator positioned in the first space and electrically connected to the first coil portion.