PCB Coil Thermal Management via 3D Via Routing
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Solution Overview
Problem
In power conversion devices, such as DC-DC converters, the temperature increase of a coil pattern between the first and second core portions is difficult to suppress due to the lack of thermal connection to a heat dissipator through thermal vias.
Innovation Solution
A circuit device with a printed circuit board and core configuration, where the coil patterns surround a through portion of the core with half a turn or more, and heat transfer members with a larger cross-sectional area than the coil portions are used to dissipate heat effectively, reducing electrical and thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the coil pattern is thermally connected to a heat dissipator through thermal vias, then temperature increase of the coil pattern is suppressed, but the part of the coil pattern arranged between the first core portion and the second core portion cannot be thermally connected due to the blocking effect of the core portions
Solution Approach 1:
The patent transitions from planar thermal connection (2D) to three-dimensional thermal connection (3D) by routing thermal vias around the core portions. The thermal vias are arranged to pass through the printed circuit board at locations that bypass the blocking core portions, utilizing the vertical dimension and lateral routing space to establish thermal connection paths that were impossible in a simple planar configuration.
Solution Approach 2:
The thermal connection structure is divided into multiple segments: first thermal vias connecting to the first coil pattern portion, second thermal vias connecting to the second coil pattern portion, and potentially intermediate thermal conduction paths. This segmentation allows each thermal via to be independently routed around the core portions, solving the blocking problem by creating multiple separate thermal connection channels instead of requiring a single direct path.
2Volume of moving object
If the coil pattern is arranged between the first core portion and the second core portion to achieve compact design, then device size is reduced, but thermal connection becomes difficult due to the blocking effect of core portions
Solution Approach 1:
The patent utilizes three-dimensional space for thermal management while maintaining compact two-dimensional footprint. The thermal vias are routed through the printed circuit board in the vertical dimension and around the core portions laterally, creating thermal paths that do not increase the planar device size but effectively manage heat from the compactly arranged coil patterns between the core portions.
Solution Approach 2:
The patent introduces intermediate thermal conduction paths (additional thermal vias and thermal conduction structures) that mediate between the coil patterns and the heat dissipator. These intermediates are strategically positioned to bypass the core portions, acting as thermal bridges that connect the heat-generating coil regions to the heat dissipator without requiring direct line-of-sight paths blocked by the cores.
3Temperature
If thermal vias are used for heat dissipation, then temperature control is improved, but the blocking effect of core portions prevents effective thermal connection to coil patterns between core portions
Solution Approach 1:
The thermal connection system is segmented into multiple independent thermal via groups, each serving specific coil pattern regions. The first thermal vias serve the first coil pattern portion, the second thermal vias serve the second coil pattern portion, and additional thermal vias provide redundant paths. This segmentation ensures that if one thermal path is blocked or fails, other paths remain functional, thereby improving overall thermal connection reliability.
Solution Approach 2:
The patent optimizes thermal via parameters (number, diameter, distribution, and routing positions) to maximize thermal connection effectiveness. By changing the spatial parameters of the thermal vias—positioning them to bypass core portions and increasing their density in critical heat-generating regions—the thermal connection reliability is enhanced without compromising the compact design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature increase and heat dissipation of the coil patterns between the core portions, allowing for efficient heat management and potential downsizing of the circuit device.
Implementation Method 1
a first heat transfer member disposed on at least one of the first portion and the third portion... Heat generated in at least one of the first portion and the third portion can be suppressed. In addition, heat generated in at least one of the first portion and the third portion can be dissipated with low thermal resistance to the outside of the circuit device.
Data Source
AI summary
A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.