Integrated Power Electronics Embedded PCB-Cold Plate Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacture of multi-layer printed circuit boards (PCBs) is complex, and existing methods face challenges in integrating power devices effectively while ensuring thermal management and electrical isolation.
Innovation Solution
A method involving bonding a power device fabrication panel to a multi-layer PCB, drilling via passageways, electroplating conductive metal into the vias, and bonding the panel to cold plates, with a low thermal resistance dielectric layer for thermal management and electrical isolation, forming highly integrated power electronics embedded PCB-cold plate assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multi-layer PCBs are used to increase component density, then the capacity and density of electronic components improve, but the design and manufacture complexity increases
Solution Approach 1:
The manufacturing process is divided into distinct panels (PCB panel, cold plate panel, power device fabrication panel) that are processed independently and then assembled together. This segmentation allows each panel to be optimized and manufactured separately, reducing the complexity of handling multi-layer PCBs as a single complex unit.
Solution Approach 2:
A low thermal resistance dielectric layer is introduced as an intermediary between the multi-layer PCB and the cold plate. This dielectric layer facilitates thermal transfer while providing electrical isolation, simplifying the integration process by handling both thermal and electrical requirements through a single intermediate component.
2Adaptability or versatility
If power devices are embedded in multi-layer PCBs, then integration improves, but thermal management and electrical isolation become more difficult
Solution Approach 1:
The low thermal resistance dielectric layer serves as a mediator that enables simultaneous achievement of thermal management and electrical isolation. It provides a controlled interface between the power devices and the cold plate, allowing heat to flow efficiently while maintaining electrical separation.
Solution Approach 2:
The patent combines multiple functions (thermal conduction, electrical isolation, mechanical support) into a single dielectric layer component. This merging reduces the number of separate components needed and simplifies the overall assembly process while maintaining effective thermal management and electrical isolation.
3Reliability
If conventional PCB manufacturing methods are used, then standardization is maintained, but high-volume manufacturing efficiency is reduced
Solution Approach 1:
The fabrication process uses standardized panels that can be manufactured independently using conventional methods, maintaining standardization benefits. These panels are then assembled in high-volume production runs, achieving efficiency through batch processing of modular units rather than custom one-at-a-time assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient thermal management and electrical isolation, facilitating high-volume manufacturing of highly integrated power electronics embedded PCB-cold plate assemblies with improved thermal communication and reduced manufacturing complexity.
Implementation Method 1
a low thermal resistance dielectric layer for thermal management and electrical isolation
Implementation Method 2
electroplating a conductive metal into the vias
Data Source
AI summary
A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)-cold plate assemblies includes bonding a power device fabrication panel to a multi-layer PCB, drilling via passageways in the multi-layer PCB, and electroplating a conductive metal into the vias before bonding the power device fabrication panel to a plurality of cold plates and forming an IPEs embedded PCB-cold plate fabrication panel. The method also includes cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies.