Power Converter Thermal Management via PCB Cold Plate Integration

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Solution Overview

Problem

Conventional DC/DC converter designs suffer from inefficient heat dissipation and increased bulkiness due to the separation of electronic components from the cold plate base by the printed wiring board, which hinders the development of lightweight and compact power converter devices.

Innovation Solution

A power converter device featuring a U-shaped cold plate base with a fluid access port and passage, combined with a shell plate assembly and spatial heat-dissipation structure, where the printed wiring board assembly is directly mounted on the cold plate base, and electronic components are secured with heat conduction glue and a metal elastic clamp for enhanced heat transfer and reduced space occupation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the printed wiring board separates electronic components from the cold plate base, then the components are protected and electrically isolated, but heat dissipation efficiency deteriorates

Engineering Contradiction:
Improvecomponent protectionVSAvoidheat dissipation efficiency
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The patent introduces a printed wiring board as an intermediary element that serves dual functions: it provides electrical isolation and protection for electronic components while incorporating through-board vias that conduct heat from components on one side to the cold plate base on the other side, thus maintaining both reliability and heat dissipation efficiency

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The printed wiring board is designed to perform multiple functions simultaneously: it acts as an electrical insulator, a structural support, and a heat conduction pathway through its internal via structure, eliminating the need for separate protection and cooling mechanisms

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of manufacture

If electronic components are levelly disposed on the printed wiring board, then assembly is simplified, but device volume increases

Engineering Contradiction:
Improveassembly simplicityVSAvoiddevice volume
Core Design Contradiction:
Ease of manufactureVSVolume of stationary object

Solution Approach 1:

The patent utilizes the third dimension (vertical space) by allowing components to be mounted on both the front and back surfaces of the printed wiring board, effectively doubling the component density without increasing the horizontal footprint, thus reducing overall device volume while maintaining assembly simplicity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a compact housing structure that encloses the printed wiring board and cold plate base in a nested arrangement, where components mounted on both sides of the board are contained within the same external envelope, minimizing the overall device volume

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves heat dissipation efficiency, reduces the occupied space by electronic components, and increases power density, aligning with the goals of creating compact and efficient power converter devices.

Implementation Method 1

The cold plate base is fastened under the printed wiring board assembly for dissipating heat generated by the printed wiring board assembly

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The bottom plate has at least one fluid access port, at least one fluid passage mounted in the bottom plate, and the fluid passage is connected to the fluid access port

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

the electronic components are secured with heat conduction glue and a metal elastic clamp for enhanced heat transfer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8811016B2Power converter device
Publication Date: 2014.08.19 DELTA ELECTRONICS (SHANGHAI) CO LTD
  • US8811016B2 patent drawing
  • US8811016B2 patent drawing
  • US8811016B2 patent drawing

AI summary

A power converter device is disclosed herein. The power converter device includes a printed wiring board assembly, a cold plate base and a shell plate assembly. The cold plate base is fastened under the printed wiring board assembly for dissipating heat generated by the printed wiring board assembly. The shell plate assembly having a top shell plate, a bottom shell plate, at least two side plates respectively mounted on the cold plate base in different orientations. The printed wiring board assembly and the cold plate base are enclosed with the shell plate assembly.