PCB Communication Bus with Etched Branch Lines
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Solution Overview
Problem
The existing communication bus systems face challenges with data losses and voltage drops due to the modification of characteristic impedance when numerous branch connectors are inserted, and the need to limit the number of branched outputs to prevent excessive voltage drop, making it complex to connect communicating devices efficiently.
Innovation Solution
The communication bus features etched communication lines and branch lines on separate conducting layers of a printed circuit with optimized spacing and dimensions, including ground conductors and power supply lines, allowing for a higher number of branched outputs while minimizing voltage drop, with the characteristic impedance maintained between 100 and 150Ω.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If numerous branch connectors are inserted along the main communication bus, then more communicating devices can be connected, but the characteristic impedance is modified causing data losses and transmission rate reduction
Solution Approach 1:
The patent transitions from a one-dimensional cable-based bus to a two-dimensional planar structure using printed circuit board traces. The communication lines are formed as conductive traces on a PCB substrate, allowing multiple branched outputs to be distributed across the plane without the impedance discontinuities caused by physical connectors. This dimensional change enables numerous connection points while maintaining consistent characteristic impedance throughout the bus structure.
2Quantity of substance
If the number of branch lines is increased, then more communicating devices can be connected, but the voltage drop along the communication bus increases
Solution Approach 1:
The patent changes the physical parameters of the communication bus by using controlled impedance traces on a PCB with specific conductor widths, spacing, and substrate properties. This allows precise control of electrical characteristics including voltage distribution and impedance matching. The planar trace structure enables optimized power and signal distribution to multiple branches while minimizing voltage drop through controlled parameter design.
3Quantity of substance
If the main communication bus is lengthened to accommodate more branch lines, then more devices can be connected, but the voltage drop and impedance variation increase
Solution Approach 1:
The patent uses the planar dimension of a printed circuit board to distribute communication lines in two dimensions rather than extending a single linear path. This allows multiple devices to be connected across the board area with shorter individual trace lengths, reducing cumulative voltage drop and impedance variation while accommodating a larger number of devices through spatial distribution.
Data Source
AI summary
Communication bus having at least one pair of communication lines designed to be connected in series respectively to conductors of a main communication bus designed to be connected to communicating devices of at least one electric panel. Said communication bus comprises at least two branched outputs each having at least two branch lines, said branch lines respectively having a first end connected to a communication line and having a second end designed for connection of the communicating devices. The communication lines are etched on a first conducting layer of a printed circuit, and the branch lines are etched on a second conducting layer of said printed circuit. The communication lines are separated from one another by a distance.