PCB Component Removal Using Measured Multi-Axis Machining
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Solution Overview
Problem
Current methods for removing bonded and soldered components from printed circuit boards in portable electronic devices often result in mechanical or thermal damage to the board and surrounding components, making it difficult to achieve the same quality and functionality as new equipment, especially when repeated repairs are needed.
Innovation Solution
An apparatus and method that utilize two machining tools with compound mutual movement along non-parallel axes, combined with precise measurement and control, to remove components without heating or damaging the board, allowing for accurate removal of components with irregular shapes and inclinations, and enabling repeated repairs with improved accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If thermal or mechanical tearing methods are used to remove components, then the component can be removed from the printed circuit board, but the printed circuit board or surrounding components are damaged
Solution Approach 1:
The patent replaces traditional mechanical tearing and thermal methods with a precision machining system that uses controlled mechanical cutting tools (milling tools, drilling tools) to remove components. The machining tools are guided by measurement data to precisely remove only the target component without damaging the printed circuit board or surrounding components, thus substituting destructive mechanical/thermal methods with controlled mechanical machining.
Solution Approach 2:
The patent employs a feedback mechanism where measurement devices (optical sensors, coordinate measuring machines) first scan and record the precise position, shape, and dimensions of the component to be removed. This measurement data is then used to generate and adjust machining paths and parameters, creating a closed-loop control system that ensures accurate removal while protecting surrounding areas, thereby resolving the contradiction between removal effectiveness and board integrity.
2Ease of repair
If conventional milling methods are used to remove components, then the component can be removed mechanically, but the printed circuit board may be damaged and cleanliness is not guaranteed
Solution Approach 1:
The patent performs preliminary measurement and scanning of the component to be removed before the actual machining process. The measurement device captures the component's position, shape, size, and surrounding board features in advance. This preliminary action generates precise machining paths and parameters, ensuring that the subsequent mechanical removal is highly accurate and clean, thus resolving the precision and cleanliness issues of conventional milling.
Solution Approach 2:
The patent applies local quality by using measurement data to generate customized machining paths that are specific to each target component's location, shape, and surrounding environment. The machining parameters (speed, depth, tool path) are locally optimized for each removal operation, allowing precise removal of the target component while avoiding damage to surrounding areas, thereby achieving high manufacturing precision and cleanliness.
3Ease of repair
If repeated heating is applied to replace sensitive components, then the component can be replaced, but the internal structure collapses or malfunction occurs
Solution Approach 1:
The patent replaces the thermal heating method with a controlled mechanical machining system. Instead of using heat to remove components (which causes internal structure collapse in sensitive components), the system uses precision milling and drilling tools guided by measurement data to mechanically remove only the target component. This substitution eliminates thermal damage while maintaining effective component replacement capability, thus resolving the contradiction between repair ease and component reliability.
Data Source
Figure 1~2
AI summary
An apparatus for removing components (6) from printed circuit boards, in which at least one machining tool is connected to movable mechanisms and/or a fastening device (2) for clamping the printed circuit board (3) is connected to them. The apparatus is equipped with at least one measuring device (4). The movable mechanisms are also adapted for compound relative movement of at least one machining tool and the fastening device (2) simultaneously along at least two axes, the movable mechanisms being connected to a control unit (9) to which at least one measuring device (4) is also connected. Also included is the method for removing components (6) in this apparatus.